Electronics Forum | Thu Aug 16 13:57:30 EDT 2001 | Hussman
Ouch! I thought that went away 12 years ago! Visual inspection to IPC standards should be used. Pulling and pushing leads is not even close to being consistent. I bet your customers or ISO auditors have never seen this practice. If they must pul
Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Electronics Forum | Fri Sep 11 15:27:50 EDT 2015 | u4bga
Hi! We're noticing white spots on 2 PCBAs after the selective soldering & DI Wash processes. ----Facts---- 1) The marking is on all boards, irrespective of date code 2) It only happens on leads that have been selective soldered 3) The pattern of w
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Nov 05 13:00:27 EST 2009 | swag
The solder joints might hook up but my opinion is you'll end up with mechanically weak joints that could fail over time. If your trying to get your Xbox back on-line at home I'd try it but not if your charging $ to fix it for someone else or re-work
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
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