Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Mon Jul 26 10:25:12 EDT 1999 | Boca
| | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that a
Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory
| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th
Electronics Forum | Thu Jun 14 00:58:06 EDT 2001 | plopez
Hello. We are a contract manufacturer that requires the removal of the green making layer on a PCB board. What we need to do is expose some of the conductive trace (estimated .025 length) to create a solder joint to a SMD. It sounds ridiculous, bu
Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS
Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a
Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS
Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a
Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Tue Dec 28 16:00:38 EST 1999 | Vahid Vatannia
Dan, Is there an article or a paper that compare solder joints strenght verses pressfit? Thnak you.
Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan
Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati
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