Industry News | 2020-11-09 14:21:48.0
SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
Industry News | 2013-10-22 12:00:17.0
Panasonic Factory Solutions Company of America announces the appointment of Systems, Materials, & Technologies Inc. (SMT Inc.) as a sales representative of Panasonic electronics assembly solutions in Northern California and Northwest Nevada.
The ideal solution for any market. Genesis features a powerful combination of speed and flexibility to blur the boundaries between high-speed and flexible fine pitch placement. Outstanding price performance combines with traditional Universal uptime
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2007-10-26 13:08:43.0
MORRISVILLE, NC - October 24, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the KE-2060RL High-speed Fine-pitch Assembler with IFS-X2 in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
Samsung SM320 Pick and Place Machine Samsung SM320 Pick and Place Machine Chip theoretical speed ：18500CPH PCB size 510 * 460MM Mounting range 0402mm Chip ~ 55mm IC Product description: Samsung SM320 Pick and Place Machine,Chip theoretical spee
Samsung SM320 Pick and Place Machine Chip theoretical speed ：18500CPH PCB size 510 * 460 Mounting range 0402mm Chip ~ 55mm IC Feeder input: 120ea Product description: Samsung SM320 Pick and Place Machine, Chip theoretical speed ：18500CPH, PCB
Samsung SM320 Pick and Place Machine Mounting range 0402mm Chip ~ 55mm IC Chip theoretical speed ：18500CPH PCB size 510 * 460mm 120ea / 112ea (docking cart) Product description: Samsung SM320 Pick and Place Machine, Mounting range 0402mm Chip
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
