Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
New Equipment | Test Equipment
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New Equipment | Test Equipment
PCB Inspection Online AOI Machine Z588 Inspection Component: 01005 chip PCB size::50×50mm-330×400mm Dimension:950mm×1000mm×1580mm Weight: 670kg Product description: PCB Inspection Online AOI Machine Z588, Inspection Co
Industry News | 2021-01-30 07:05:46.0
Most wave soldering systems installed in electronic productions are equipped with one or two solder nozzles that generate a turbulent wave. This configuration is ideal for most products; however, this concept reaches its limitations if, for example, PCBs in masks are to be processed. The reliable wetting of all solder jointsis not guaranteed, depending on the thickness of the mask and the size of the cutouts. Additionally, it might be challenging to achieve a reproducible process if the distances between covered SMD components and the THT pins to be soldered are too small. Sophisticated assemblies that are processed in soldering masks often show soldering defects such as incomplete solder joints or solder bridges.
New Equipment | Rework & Repair Equipment
Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair Product Application Factort price automatic bga replacing machine iphone motherboard repair station ZM-R6200 can desolder and solder all the BGA Chip, remove and replace different
New Equipment | Test Equipment
Offline AOI Machine Z5 Dimension:900*1080*1350 mm Max PCB size:330x480mm Inspection Component: 0201 chip Weight:Aprox. 450kg Product description: Offline AOI Machine Z5,Dimension:900*1080*1350 mm,Max PCB size:330x480mm,Inspection Component: 0
Online Automated AOI Machine Z588 Inspection Component: 01005 chip PCB size::50×50mm-330×400mm Dimension:950mm×1000mm×1580mm Weight: 670kg Product description: Online Automated AOI Machine Z588,Inspection Component: 010
SOnline Automated AOI Machine Z588 Inspection Component: 01005 chip PCB size::50×50mm-330×400mm Dimension:950mm×1000mm×1580mm Weight: 670kg Product description: Online Automated AOI Machine Z588,Inspection Component: 01
PCB Inspection Online AOI Machine Z588 Inspection Component: 01005 chip PCB size::50×50mm-330×400mm Dimension:950mm×1000mm×1580mm Weight: 670kg Product description: PCB Inspection Online AOI Machine Z588 INQUIR
Automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of