Industry News | 2017-02-15 18:32:20.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it received the prestigious 2017 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center.
Industry News | 2018-02-28 17:52:51.0
MIRTEC, “The Global Leader in Inspection Technology”, announces that it received the prestigious 2018 Service Excellence Award (SEA) from Circuits Assembly Magazine in the category of Test and Inspection. This is the fourth year in a row that MIRTEC has received this award for outstanding customer service! Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center.
Industry News | 2019-01-30 08:03:04.0
MIRTEC, “The Global Leader in Inspection Technology”, announces that it received the prestigious 2019 Service Excellence Award (SEA) from Circuits Assembly Magazine in the category of Test and Inspection. This is the fifth consecutive year that MIRTEC has received this award for outstanding customer service! Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center.
Industry News | 2020-02-06 04:17:15.0
MIRTEC is pleased to announce that it received the prestigious 2020 Service Excellence Award (SEA) from CIRCUITS ASSEMBLY magazine in the category of Test and Inspection. This is the sixth consecutive year that MIRTEC has received this award for outstanding customer service! Mike Buetow, CIRCUITS ASSEMBLY’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2009-03-16 18:07:28.0
OXFORD, CT � March 2009 � MIRTEC, �The Global Leader in Inspection Technology,� announces that it will introduce the latest advancements to its MV Series of AOI systems as well as unveil the company's first In-Line SPI System, the MIRTEC MS-11, in booth 147 at the upcoming APEX exhibition & conference scheduled to take place March 31- April 2, 2009 in Las Vegas.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2013-01-16 11:21:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013
Industry News | 2011-12-14 16:19:46.0
MIRTEC announces that ACD purchased two Mv-7xi In-Line AOI Systems during the recent Productronica Trade Fair in Germany. ACD has very high inspection standards and the new MV-7xi AOI systems will help the company continue to meet or exceed those requirements.
Industry News | 2016-03-18 10:45:49.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it received two awards at the 2016 IPC APEX EXPO. MIRTEC’s MV-6 OMNI 3D AOI system was recognized with a 2016 New Product Introduction (NPI) Award in the category of Test & Inspection – AOI. Additionally, MIRTEC received the prestigious 2016 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the awards to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center.
Industry News | 2003-06-10 08:56:19.0
Seeing the increasing number of electronic products having image capturing functions in the market, the Company has decided to seek to further augment its manufacturing capabilities to produce image sensors to satisfy order demand for these components.
