Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Sun Nov 06 14:12:07 EST 2005 | Danmens
I am looking for someone very familiar with ASM wire-bonders (AB356) to train us after hours on a temporary basis. You must reside in MA, NH or RI. Send an e-mail if you are interested. dmendoza@mnc.com
Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit
Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak
Electronics Forum | Tue Mar 16 18:36:11 EDT 2010 | janz
Looking for a large area wire ball bonder or > wedge bonder. Must be able to take 4" X 5" panel > and have a bond area of close to 3.5" X 4.4". > Also need 6 to 8 wire per second. K&S no longer > makes one. Panasonic no longer makes one. ASM
Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
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