Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d
Used SMT Equipment | Depanelizers / Routers
The Cencorp TR5000 series accommodates a wide range of depaneling processes including tab reduction, routing in pallets, full board routing, and output to flat belt or downstream automation or packaging systems. This unit is located in the CEE faci
Career Center | Buffalo, New York USA | Engineering,Production,Quality Control,Technical Support
The Process Engineer will lead overall improvement in the area of yield enhancement, reduction in non-conforming components and assemblies, as well as cost saving initiatives. An important attribute of this position is the use of SPC for variation i
Technical Library | 2018-10-10 21:26:52.0
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll to roll processes. Printed electronics is improving in performance and has many applications that compete directly with printed circuit boards. The advantage of roll to roll is the speed of manufacturing, the large areas possible, and a reduction in costs. As this technology continues to mature, it is also merging with the high profile 3D printing. (...)This paper will show working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
TR7700 SII Plus CI brings easy Conformal Coating Inspection that combines a high precision optical design with specialized multi-phase lighting to inspect UV-active Conformal Coatings. Smart software and multi-phase imaging ensure the TR7700 SII Plus
Industry Directory | Manufacturer
Nett Technologies Inc. is a manufacturer of emission solutions using diesel oxidation catalyst (DOC), diesel particulate filter (DPF), selective catalytic reduction (SCR)system technologies.
Technical Library | 2018-12-12 22:20:22.0
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.
