Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey
| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr
Electronics Forum | Thu Dec 24 13:43:30 EST 1998 | Earl Moon
| | | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. T
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours
| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .
Electronics Forum | Wed Mar 10 17:03:52 EST 1999 | Morziana Hasan
NASA CommQuest Photopolymerized Conducting Polymers Directions: 1.Please read the information provided on this technology. You may follow the links to additional information resources below. 2.After evaluating the technology, please answer the
Electronics Forum | Wed Feb 25 08:34:00 EST 1998 | Earl Moon
CERAMIC CIRCUITRY Starting with hybrid thick film circuits in 1965 at Sperry Flight Systems, I have been involved with ceramics (usually aluminum oxide) as the substrate material. Then, we developed "multilayer" circuitry (replacing "cordwood" module
Electronics Forum | Wed Feb 25 08:30:44 EST 1998 | Earl Moon
| Happy Holidays All, | I am searching out a vendor (US preferred) who can fabricate a ceramic PCb with etremely fine lines. | Please reply if you are a vendor, or know of one. | Thanks, | Wendy CERAMIC CIRCUITRY Starting with hybrid thick film circ
