Full Site - : alumina (Page 7 of 10)

High temp conductive material needed

Electronics Forum | Tue Jun 22 17:14:41 EDT 1999 | Dennis Fall

I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substrae)

Re: High temp conductive material needed

Electronics Forum | Wed Jun 23 10:21:25 EDT 1999 | Chrys Shea

| I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substra

Re: single pin connector

Electronics Forum | Tue Jul 20 08:37:42 EDT 1999 | Dave F

| First of all, I'm a young Spanish so sorry for my English | | I'm looking for a smd single pin connector. I need it to solder it in a alumina's substrate. | | Please. can anybody help me ? | Baddia: That everyone with English as their first la

Re: single pin connector

Electronics Forum | Fri Jul 23 06:44:33 EDT 1999 | George Verboven

| First of all, I'm a young Spanish so sorry for my English | | I'm looking for a smd single pin connector. I need it to solder it in a alumina's substrate. | | Please. can anybody help me ? | Go to the following adress: http://www.keyelco.com/ke

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 03:10:22 EDT 1998 | Terry Keen

| Couple of questions. | 1) Are we talking alumina substrates as the ceramic material? | 2) Are we co-firing gold as the conductors on the substrate surface? | 3) In other words, is this a hybrid thick film circuit? | 4) If so, how large or small? S

2512R Lead Free Solder Joint Reliability

Electronics Forum | Mon Aug 06 17:29:07 EDT 2007 | gsala

Hi Gents, I heard people having concernes by using 2512R SMD resistors due to potential solder joint reliability defect(CTE mismach among ceramic/alumina+solder+PCB) when soldered by lead free alloys (SAC like). Any experience/news about solder j

Wirebond issues near SM

Electronics Forum | Fri Oct 30 09:19:46 EDT 2009 | cab

We have performed some EDS analysis and found high percent (approx 18% ) of Ni on surface of gold pad. Found Tungsten as well. This is an HTCC alumina package. Thickness of gold was confirmed and found to be in spec. We believe we are dealing wi

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or

Re: Printing and Reflow with Ceramics

Electronics Forum | Wed Aug 12 07:31:37 EDT 1998 | Earl Moon

| We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are ther

Jammed Boards and Conveyor Rail Wear

Electronics Forum | Thu Jun 19 09:33:09 EDT 2008 | stevenvl

Hi, I'm having issues with boards sticking/jamming along the line, as well as what seems to be excessive wear along the guide rails. The boards are an Alumina Ceramic material and the rails differ by machine, but include anodized aluminum, steel, de


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