While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects. Print transfer efficiency of the solder paste must be maximized to maintain consistent solder volumes and acceptable solder joints; process optimization may also be a factor. Flux activators have to be redesigned to allow for the less-than-ideal soldering performance of high-tin alloys. These challenges have been met by a statistical approach to formulating solder paste rheology and flux chemistry resulting in high print efficiencies and appropriate activity release to produce high first-pass yields.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.