by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute of Technology, Scott Rushia; Martin
As more components are becoming lead free and not available in the tin lead alloy, there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the strength of those components. This is particularly true for legacy parts needed for military applications some of which use tin lead solder. There is cause for concern due to the potential mixing of alloys and the differences in reflow temperatures of the two different alloys. Additionally, there are unknown characteristics regarding the intermetallics that are formed due to the potential of mixed alloys.
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength.
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