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3D IC Development Needs Innovative Socket Solution

Main Board PCB Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions.

3-D packaging can be achieved via die stacking in one package, package-in-a-package stacking or package on package stacking. Each method has its pros and cons. Package on package stacking, which has been researched in a variety of formats, enables stacking of packages from different suppliers and mixed IC technologies. It also allows for burn-in-testing prior to stacking.

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Authors: Ila Pal

Organization: Ironwood Electronics

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SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: International Wafer-Level Packaging Conference & Tabletop Exhibition - October 11 - 14

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SMTnet Express
October 7, 2010

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