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Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

CSP I/O traces and component orientation This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.

The test boards were subjected to drop tests at several impact pulses (...) Two edge-bond materials used in this study were a UV-cured acrylic and a thermal-cured epoxy material. Tests were conducted on CSPs with edge-bond materials and CSPs without edge bonding. Statistics of the number of drops-to-failure for the 15 component locations on each test board are reported. The test results show that the drop test performance of edge-bonded CSPs is five to eight times better than the CSPs without edge bonding.

Authors:	Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J.Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger.
Company / Organization:	Cal Poly State University, Henkel Corporation, Flextronics International

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March 31, 2010

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