Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and, most notably, center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
The fastest growing package types in the electronics industry today are Bottom Termination Components (BTCs). While the advantages of BTCs are well documented, they pose significant reliability challenges to users. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies. This is especially true for new component packaging like BTCs. Obtaining relevant information can be difficult since information is often segmented and the focus is on design opportunities not on reliability risks (...)
Commonly used conformal coating and potting processes have resulted in shortened fatigue life under thermal cycling conditions. Why do conformal coating and potting reduce fatigue life? This paper details work undertaken to understand the mechanisms underlying this reduction. Verification and determination of mechanical properties of some common materials are performed and highlighted. Recommendations for material selection and housing design are also given.
Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive.
The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.
Solder Pastes Inspection parameters -- We have a PARMI SigmaX SPI (Solder Paste Inspection) machine, right now I'm trying to understand about parameters of the machine. I know minimus, Maximus, and warning values need to be defined. Height value understands that can be defined by the thickness of the stencil. Volume with the stencil thickness times the aperture size (what's the formula to do this)? We've been having a lot of trouble with missing solder paste, so I want to understand a little bit more about how I can define the parameters, and how can i close the minimum and maximum to ensure solder paste it is being well applied without any insufficient solder paste.
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Universal Genesis 2 dual beam damaged by packers, worth fixing? -- I bought a gx37 dual beam series 2 Genesis. It looks like it was in very good condition when it left Malaysia but the axis weren't secured at all for the sea journey. When it arrived the rubber stoppers had all been smashed. The z axis on both heads fails to zero when I've turned it on. Will the most likely be fixable at a sensible price or should I give up on it?
The Branford Group ("Branford"), a leader in asset valuation and disposition services, in partnership with Maynards Europe, will be hosting (2) public online auctions to sell surplus assets of Tring & Fela - renowned PCB Manufacturers. The equipment offerings will be available for bidding via two online auction events with Fela closing on September 20th at 11:00 am (CET) and Tring closing on October 4th at
11:00 am (CET)...
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced....
Separating skip scored V-Scored PCB panels up to 48" long is made simple and easy with the K4000 PCB depanelizer from FKN Systek. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable....
FEATURING | Surplus to the Ongoing Needs of Tring Timed Online Multilayer PCB Manufacturer High Technology Circuit Board Facility Schmoll DI | Schmoll Drilling | ATG Testing | Camtek AOI Complete Facility, Equipment as late as 2020
SCHEDULE | Mon, Sep 25 - Wed, Oct 4, 2023
OPENS | Monday, September 25, 2023 8:00 AM (CET)
CLOSING BEGINS | Wednesday, October 4, 2023 11:00 AM (CET)
EQUIPMENT LOCATION | Gracanica, Bosnia
FEATURED EQUIPMENT | FEATURED ITEMS | Schmoll MDI Single Table Direct Imager (2 Heads) yr. 2020, Schmoll Drilling & Routing Machine LM2, Jetrite Ink Jet Legend Printer, Schmoll MX1-160 CCD Drilling Machine, Auto PCB V-cut Machine, Model No: CK-1500, ORC HMW 201 B Exposure Unit, 5kW,, OLEC AT30 Exposure Unit, ATG Flying Probe Tester Type A1-1037, Eight Probes, HML LP 2000 VK 2 Lamination Press, UNIPLATE P Permaganate Line, Telmec Scoring Machine, Type SL13.9, MIVA Photo Plotter, Type 2512E T3, Camtek AOI, Type: Orion-604, Camtek AOI, Type: 808, Cemco Quick Silver HASL (leadfree), Targomat - hole drilling machine, Mania Speedy 580 Flying Probe Test System, Lenz CNC Drilling Machine GX4620-2 AL, Lenz CNC Drilling Machine PT 415-2 L, Schmoll Maschinen Auto-System 3, Pill 1050 Alkaline Etching Machine Pill 1050, Pill Tin Resist Stripper, Pill OSP Chemical Line, Holmstand - Soldermask Developer, Pill Resist Developer 1146, Type EXPORT 650, Glutz & Jensen, Type 720 Film Developer, SCHMID Brushing Machine, Posafor Pinning Machine, Wessel/FSM, Type SEPO Pinner, Dynachem 1600IV, Automatic Cut Sheet Laminator, Orbotech Legend Printer, Type: Sprint 8 - (spare part machine), Otto Dilg Brushing Machine, Penta 550 Hot Air Leveler, Dust Extraction System, Numerous Laif-Corema-Mass-Weimer Loaders & Unloaders
SUMMARY OF QUALIFICATIONS: Interview scheduling via Leo/Zoom, onsite, travel, onboard integration to include directors, HR staffing and interns, Welcome First Day communications, Sterling BGI support, Prehire Covid tracking, I9 administration, college team surge support, Y1X SAP Workzone Resource Box, manage TA Specialist sharepoint and HRMS LMPeople corrections
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.