It is now widely accepted that using designed experiments is the most effective way to optimize surface mount technology (SMT) processes. This situation begs the question "what is an effective strategy in implementing this powerful tool?" This paper will present such a strategy that incorporates Taguchi's approach for screening, full factorial analysis for optimization and central composite design for precise modeling. We will present these techniques using MINITABTM Release 13 statistical software and printed circuit board industry applications.
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
The technical tips have offered valuable details and techniques into various aspects of electronics manufacturing. This has been validated by the reader responses concurring with our assessments, offering additional insight, or in some rare cases, stating divergent points of view on any particular matter. In a bit of a strategic departure from the normal range of electronic manufacturing topics, ACI Technologies,Inc. would like our readers to consider the importance of being well prepared in the arena of designed experiments in order to properly qualify a manufacturing process. This particular topic has relevance because of the associated scope of work ACI Technologies encounters in numerous projects from material R&D to manufacturing process optimization, which require appropriate experimental designs to ascertain the significant data.
Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer driven product performance requirements. Manufacturing strategies today require process equivalence. That is to say, if a product is made or modified in different locations or processes around the world, the result should be the same. If cleaning is a requirement, will existing electronic assembly cleaning processes meet the challenge? Innovative cleaning fluid and cleaning equipment designs provide improved functionality in both batch and continuous inline cleaning processes. The purpose of this designed experiment is to report optimized cleaning process parameters for removing lead-free flux residues on populated circuit assemblies using innovative cleaning fluid and batch cleaning equipment designs.
Statistics originally served to describe matters of the state (status of state) by capturing numerically various aspects of full populations. Today this is called a census, from Latin censere (to count or estimate). Recall the historical census of Emperor Augustus. Nowadays the field of statistics focusses mainly on samples, i.e., part of the total. The goal is to make statements or conclusions about the whole population. This process is referred to as induction, from Latin inducere (to lead to). Its validity depends crucially on the process of sampling.
Sn99Cu07 and Sn100 -- Dear proffessionals!
Question is about this alloys - Sn99Cu07 and Sn100 (Sn100C,Sn100Ni+ etc.). Is it O'k to mix them? In my case to use Sn99Cu07 as addition to selective soldering machine bath with Sn100C? Main components are the same, but minor additives are different...
Also may be somebody can compare this alloys - which one is better, or the are almost the same in production?
Thanks!
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QFN/BTC Side Termination - Fillets and Wettability -- Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting?
Is it simply if the side terminations are plated in the same way the bottom terminations are, then fillets are likely/preferred?
If not plated and only exposed copper from packaging process, does that indicate no side fillets?
Heraeus Electronics introduces the PTC4900 Series Self-Regulating Heater Inks, a breakthrough in heater technology. These customizable PTC (Positive Thermal Coefficient) inks offer enhanced performance, expanded operating temperatures, and unparalleled customization options. Designed for precise temperature control, they are suitable for various applications, including EV battery heaters, ADAS heaters, flooring heaters and cabin comfort heaters....
CalcuQuote is pleased to announce that Dorigo Systems, a leading provider of electronic manufacturing services (EMS) based in Burnaby, BC, Canada, has chosen the QuoteCQ RFQ Management System to upgrade its quote process. This collaboration brings enhanced efficiency and optimization to the quoting process at Dorigo....
Equipment from a Custom Thick Film Hybrid Micro Electronics Manufacturer
Clean Room, Assembly, Test & Inspection Equipment — Owner Retiring, Everything Must Go!...
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.