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SMTnet Express, January 12, 2023, Subscribers: 24,747, Companies: 11,692, Users: 27,678

█ Electronics Manufacturing Technical Articles

Since the implementation of lead-free soldering, solderability issues appear to have become more common. The higher soldering temperature releases volatiles creating solder voids. The higher temperature also increases board and component flexing. Surface mount components fall off boards and BGA (Ball Grid Array) balls crack cleanly at the intermetallic interface creating open circuits. Black pad is often found as the root cause of these issues. However, black pad is a catch-all expression used to describe a variety of problems. As common as it is, black pad is not always recognised. What does it look like? How can one differentiate black pad from other soldering defects? We present high resolution optical and SEM (Scanning Electron Microscopy) images of real-life soldering problems, demonstrating the difference between black pad issues, flexing issues and component issues, pointing at specific features identifying the syndrome.

Credit: MuAnalysis

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages ...[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Credit: Celestica Corporation

ACHIEVING A SUCCESSFUL ENIG FINISHED PCB UNDER REVISION A OF IPC 4552 MACDERMID ENTHONE

The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad.

Credit: MacDermid, Inc.

Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold

Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability — all very costly.

Credit: Uyemura International Corporation

High Phosphorus ENIG — highest resistance against corrosive environment

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment — such as high humidity or pollutant gas.

Credit: A.T.E. Solutions, Inc.

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█ Printed Circuit Board Assembly & PCB Design Forum

Nozzle diameter error -- Hi, i've been struggling with register nozzles into Panasonic & NPM machines. I determinate all the nozzle dimensions correctly but while pick and placing some error occurs and it says nozzle diameter error. how can i fix this?

Tombstone -- Smt juki 2060 is constantly throwing Tombstone error messages when using 0402 parts. Is there something possibly that needs adjustment? Almost every part comes up with the error message at the beginning of the Run and they're all tombstone messages but are aligned perfect when tracked. Nozzle is correct size. Checked already. Was curious if anybody any hints or tricks as to what possibly is making this happen on a regular basis so that I can help this process move forward or am I always going to have to deal with this on these machines

SEARCH the PCB Assembly Forum VISIT the PCB Assembly Forum...

█ SMT, PCB Electronics Assembly Manufacturing Industry News

XDry Announces 15th Anniversary of Pioneering Humidity-Controlled Storage

XDry Corp. celebrates its 15-year anniversary in 2023. Founder Kevin McCarten was an early pioneer in the design of humidity-controlled storage — also known as auto-electronic desiccator storage cabinets....

XDry

Volatility and Uncertainty will Continue to Influence Economic Outlook in the Early Months of 2023

IPC issues December Economic Outlook report...

Association Connecting Electronics Industries (IPC)

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California....

Surface Mount Technology Association (SMTA)

GET more Electronics Assembly Manufacturing News...

█ SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

PCB DISPENSING

MAX II (Heated) High Precision Dispensers

GPD Global

Printing

Full-auto SMT Stencil Printer I.C.T-P4034

I.C.T

SELECTIVE SOLDERING

Pillarhouse Jade Handex

Pillarhouse USA

PCB INSPECTION

MV-3 FIVE CAMERA In-Line AOI System

Mirtec

Software

Unisoft ProntoAOI - AOI Machines Programming Software

UNISOFT Corporation

PCB REFLOW OVEN

1910 MK5 Dual Lane, Dual Temperature Reflow Oven

Heller

VIEW More New Electronic Manufacturing Products...

█ SMT / PCB Assembly Equipment Auctions

AUCTION | Analog Devices Surplus Equipment

AUCTIONEER | Baja Bid

TYPE | Online Auction

FEATURING | Items Including — Brown & Sharpe 1024U Universal Grinding Machine, Bryant Center Hole Grinder, American Turnmaster 5 HP Variable Speed Lathe, Brown & Sharpe No. 1 Universal Grinding Machine, Kalamazoo Starstrite 30-R Vertical Bandsaw, Hurco SM1 3HP Milling Machine, Harig 618 1 HP Surface Grinder, Browne & Sharpe Center Checker, Bewo Circular Chop Saw, Delta Triple Duty Ball Bearing, Delta Ball Bearing Carbide Tool, Rockwell Drill Press Floor Mount, Burn-In Chamber, Surface Plates, Work Stations, Storage Cabinets, Assorted Machine Toolings

SCHEDULE | Mon, Jan 9 - Fri, Jan 20, 2023

SCHEDULE: Opening Starts | January 9, 2023 [8:00 am EST]

SCHEDULE: Closing Starts | January 20, 2023 [1:00 pm EST]

VISIT the Assembly Equipment Auctions Calendar...

█ Electronic Equipment Mart

MART - Used Electronic Assembly Machines For Sale

P&P / Feeders

Assembleon AX201

KD Electronics - Assembleon AX201

KD Electronics

AOI INSPECTION

Viscom S3088 Ultra Chrome 3D AOI

Lewis & Clark Viscom S3088 AOI

Lewis & Clark

DEK NEOHORIZON 03iX

SMTUnion - DEK NEOHORIZON 03iX

SMTUnion

P&P / Feeders

Assembleon /Yamaha Opal-X II Pi

World Equipment Source - Assembleon /Yamaha Opal P&P

World Equipment Source, LLC

P&P / FEEDERS

Panasonic NPM-W P&P

AllSurplus Panasonic NPM-W P&P

AllSurplus

VIEW More Used Equipment For Sale... SEND a RFQ to Equipment Suppliers ....

MART - Used PCB Assembly Equipment Wanted To Buy

WIRE STRIPPERS

Autosplice SAS/2

Baja Bid - Autosplice SAS/2

Baja Bid

P&P / FEEDERS

Assembleon MG-1R

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

PCB TEST

Agilent 3070

Lewis & Clark Agilent 3070

Lewis & Clark

PCB TEST

Agilent 3070

KD Electronics Agilent 3070

KD Electronics

SEE Buyers' Used Assembly Equipment Wants

█ Electronics Manufacturing & Assembly Events Calendar

EVENTS

Dallas Chapter Technical Luncheon: 3D Printing of Tooling and Fixturing for the Manufacture of Electronics | January 13 to 13

SMTA

Pan Pacific Microelectronics Symposium | January 30 to February 2

SMTA

█ Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training

TRAINING - PCB Inspection Electronics Manufacturing Training Courses

IPC-A-640 Interactive PCB Inspection Lab (CIT or CIS Option)

Multiple dates and location. Check the link for details

EPTAC Corporation

TRAINING - PCB Rework and Hand Soldering Training Courses

TRAINING - Online Electronics Manufacturing and Assembly Training Courses

IPC J-STD-001 Trainer (CIT) Certification Online Live Training Course

Online/On-Demand

EPTAC Corporation

Live Online Training - IPC/WHMA-A-620 Expert (CSE) Certification Training Course

Online/On-Demand

ACI Technologies, Inc.

Live Online Training - IPC/WHMA-A-620 Trainer (CIT) Certification Training Course

Online/On-Demand

ACI Technologies, Inc.

Live Online Training - IPC-A-610 (CIT) Recert.

Online/On-Demand

ACI Technologies, Inc.

Reflow Soldering 101 Training Course

Online/On-Demand

Surface Mount Technology Association (SMTA)

Selective wave soldering academy

Online/On-Demand

Pillarhouse USA

Online IPC-A-610 Trainer (CIT) Training & Certification

Online/On-Demand

Blackfox Training Institute, LLC

VISIT All Electronics Manufacturing Training Courses...

█ Electronics Manufacturing & PCB Assembly Jobs

CAREER CENTER - Job Needs & Wants

JOBS - POST your job openings now

Quality Engineer

Brooksville, Florida, USA

Spartronics

Site Director

Watertown, South Dakota, USA

Spartronics

Senior Sales Executive- Aerospace & Defense- Remote- Anywhere in US

Williamsport, Pennsylvania, USA

Spartronics

Business Development Manager (REMOTE)

Minneapolis, Minnesota, USA

Spartronics

CEO

Shenzhen, China

Wiseinstrum Co.,Ltd.

Engineer

Clamart, France

MICROPORT CRM SAS

Test Engineer

Watertown, South Dakota, USA

Spartronics

SMT Process Engineer

Watertown, South Dakota, USA

Spartronics

RESUMES - POST your resume now

0 Electronics Manufacturing & PCB Assembly Resumes

POST your resume on SMTnet

FIND your next job now... FIND your next employee now...

█ PCB Design & Assembly Industry Associations

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles)

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.