In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages - QFN and an Agilent package called TOPS - on PCBs with a Ni/Au surface
finish.
GSM Spindle Runout Error -- We are in process of calibrating one of our GSM machines; we were able to successfully calibrate the front and rear ULC's but when we moved on to calibrate the head we get a spindle runout error midway through the routine (pic attached.) The spindles do not appear bent and we've never had placement issues before.
Does anyone know any common causes of the spindle runout error?
Views: 1572
Rotten smell from Electrovert Aquastrom 100 -- Hello Forum,
My washing machine have this rotten smell that I'm not sure where it comes from. I cleaned all the filters, changed new water, pretty much cleaned the whole machine but the smell still there. If anyone had this problem please advice. Thank you in advance.
Since partnering with Heller Industries last year, Altus Group, a leading supplier of capital equipment for the electronics industry, has seen growing interest in the company's reflow oven technology including its latest innovation, the MK7....
FEATURING | Please join us for our upcoming online auction featuring assets from Jabil Hungary -
Bidding Opens July 27, 2022 7:00 AM EST / 1:00 PM CEST
First Lot Begins Closing: August 3, 2022 7:00 EST / 1:00 PM CEST
Auction Link: https://bit.ly/3z8JG6L
Featuring:
2014 Vi Technology PI Primo Solder Paste Inspection
2016 Vi Technology PI Primo Solder Paste Inspection
2016 Vi Technology PI Primo Solder Paste Inspection
2005 IPTE NTM 4133 SpeedRouter
2007 Ferromatik K-TEC 275 S Injection Moulding
In conjunction with our partners at The Branford Group & Hilco Industrial
FEATURING | Please Join us for our upcoming Online Auction featuring assets from Jabil Wuhan
Bidding Opens July 28, 2022 8:00 PM EST / 8:00 AM China Standard Time.
Bid closing begins: August 2, 2022 at 9:00 PM EST in US / August 3, 2033 at 9:00 AM China Standard Time in China
Auction Link: https://bit.ly/3zynHYq
Featuring:
2014 GKG, G5 Automatic Screen Printer
Pfeiffer HLT-270 Helium Leak Detector
Temperature Chamber GDWS-300L
Wire Bonders
V Cut PCB Separator
Wire Bond Pull Testers
Vacuum Pumps
UV Curing Units
Ultrasonic Cleaner
Fiber Winder FS-230
Summary of Qualifications:
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat Shrink coating, Potting,5S Trained]
Summary of Qualifications:
I had 4 years experience 3 years in SMT Field and 1 year in Stock Market I have well experience in SMT process and machine Knowledge personally I have well knowledge on reflow, SPI,DEK AOI I can handle the process related issues and tackle the situation
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.