IPC 7095 BGA Rework Certification

This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the line BGA Rework Systems. Topics include a review of thermal profiling, preheat considerations, process techniques, review and interpretation of x-ray results.

There are two methods you might use to identify and build a BGA rework profile. Which one you will use will depend on whether or not you have a test profile printed circuit board or sample PCB available. Your options are:

• Test PCB Profiling – If you have a sample available, you can create a profile through thermocouple embedding. You attach the thermocouple to the solder ball on the side of the BGA ball with epoxy or into the BGA joint by drilling a hole and putting the thermally conductive epoxy inside. You then route the thermocouple between the balls or beneath the printed circuit board.
• No Dedicated Profile PCB Profiling – In this case, you will push insulated thermocouples under the center of the BGA. Your goal is to generate an approximation of joint temperatures to create a BGA rework profile.

In both cases, it is important to monitor not only overall PCB temperature but also BGA part center and edge joint temperatures.

This is a 2 or 3-day optional course. One day lecture and up to 2 - days of hands-on training. Each student will be able to practice installing, removing, and re-balling BGA components using both Lead & Lead-Free Solders.

$800.00 per person.