Mar 11, 2011 
MIRTEC will feature an MV-7xi configured with the exclusive 15 Mega Pixel ISIS Vision System and proprietary 3D AOI technology in booth #1925 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 in Las Vegas. All attendees are invited to visit with MIRTEC for a first-hand demonstration of this new technology.
MIRTEC also will exhibit an MV-7xi In-Line AOI System configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. The patented "Quad Angle Lighting System" provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi on disaply at APEX will feature a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. The system also will be configured with MIRTEC’s exclusive Intelli-Scan Laser System. This advanced technology offers superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. The MV-7xi is powerful yet simple to use. A comprehensive Package Type Library provides simple "Drag and Drop" component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.
The MIRTEC MV-3L Desktop AOI System is the industry’s most widely accepted five camera desktop AOI system. New to IPC APEX 2011, MIRTEC will display an MV-3L configured with a Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.
The MIRTEC MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen print. The MS-11 will inspect for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. New at IPC APEX 2011, the MS-11 will be configured with the 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightening fast inspection rates. The MS-11 uses the same robust platform as MIRTEC’s MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process.
At the booth, visitors can learn more about MIRTEC’s total quality management system software, Intellisys. The software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies. Intellisys also provides remote debugging and monitoring of up to eight production lines, allowing MIRTEC customers to further maximize the efficiency of the inspection process. Typical programming time is under one hour per assembly. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.
"MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment," continued D'Amico, "IPC APEX has always been the perfect forum to display new and innovative technology. With this in mind, we at MIRTEC chose IPC APEX to unveil our most technologically advanced AOI and SPI products to the electronics manufacturing industry. We are confident that this ground-breaking technology will undoubtedly set a new standard by which all other inspection equipment will be measured. We look forward to welcoming visitors to our booth #1925 during the three day event."
MIRTEC (http://www.mirtecusa.com) is a leading global supplier of automated optical inspection systems to the electronics manufacturing industry.
