Jan 05, 2011 
According to Practical Components’ President Kevin Laphen, “Practical is committed to ensuring that electronics assembly engineers and technicians have access to the latest in high-technology components. This innovative component is the next step in 3-D package stacking density and everyone who wants to grow their business and qualify their process needs to be familiar with this groundbreaking technology.”
After the success of Amkor’s double and triple stack PoPs with the PSvfBGA base technology, Amkor has added a new higher density PoP structure using through mold via TMV® technology. TMV enables single or stacked die structures in the bottom package using both wirebond and flip chip interconnection.
TMV PoP is seeing strong adoption in higher density package stack applications.
The Amkor TMV® PoP technology provides several key benefits:
- Enables scaling of the PoP stacked interface to 0.4 mm pitch in support of emerging high-density memory architectures.
- Allows for larger silicon area within an existing package footprint, benefiting both system architects and IC designers.
- Supports flip chip, wirebond, stacked die and passive integration within the bottom package for increased integration and design flexibility.
- Provides for reduced package warpage enabling thinner PoP stacks and improved surface mount assembly for high-density, fine-pitch applications. PoP packages provide a platform to cost effectively expand options for logic and memory 3-D integration
The Practical Dummy Component® version of the TMV® is identical to the live package without the expensive IC die inside. The dummy versions are made of the same materials on the same manufacturing lines and have the same size, thermal and soldering properties as the live equivalent.
Practical Components® is the exclusive supplier of Amkor Technology Dummy Components. Amkor offers the industry’s broadest array of package formats and sizes, from traditional, “off-the-shelf” leadframe configurations to leading-edge chip scale, flip chip and now TMV® PoP. This allows Amkor to be a single source for many of Practical Components’ customers’ total IC packaging requirements.
Since 1996, Practical Components has been the world’s leading supplier of dummy components, which are the exact mechanical equivalents of live components, used when only the physical properties of the components are required. These components can cost as much as 80% less than live components, making them ideal for testing of solder processes, machine setup and other process evaluations. Practical Components is headquartered in Los Alamitos CA and has a worldwide distribution network. For more information, visit http://www.practicalcomponents.com
