Sep 15, 2010 
Technical discussion topics will include Next Generation Board Level Underfill (BLUF), Lead Free No Clean Soldering Materials, Heterogeneous Assemblies, Counterfeit and Reworked Components, Cleaning Challenge, Nitrogen Use for Lead Free Soldering, Head and Pillow Defects, Cool Chain Management, and 01005 Development and Implementation. The presentations will be given by leading experts from Intel, Kyzen, DEK, World Micro, Flextronics, Air Products, and PAW Technology.
Participating Exhibitors:
- Air Products
- BTU
- Chip Hua
- Chiptronics
- DEK
- DNIV
- DSquared
- LeChamp
- Finetech
- Kyzen
- SIP
- Transtec
- Ultracore
- World Micro
Visit http://smtapenang.com.my/news/index.php#SMTAVendorShow for more information.
Contact Bernie Selva at Bernie@smta.org with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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