Apr 25, 2012 
Umut Tosun, Application Technology Manager at ZESTRON, the globally leading provider of high precision cleaning products and services, will present “Is Cleaning Critical to PoP Assemblies?” as part of the IPC’s 2012 Spring Webinar Series and is scheduled for Tuesday, May 8, 2012, 10:00 am to 11:00 am Central Standard Time.
This webinar will provide detailed information about the importance of cleaning PoP assemblies and insight on how to best achieve required cleanliness levels.
Package on package (PoP) assemblies are increasingly utilized for applications that require small footprint technology. Typically, this integrated circuit design stacks and integrates logic and memory packages, thereby increasing board density and substantially expanding functionality within the same footprint of a single BGA.
Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This webinar will address the cleanliness levels of PoP assemblies, including underneath components and in between packages. This information was originally presented at the SMTA International Conference 2011.
For more information and to register for this webinar, please visit http://www.ipc.org/calendar/2012/webinars/Individual-Spring12-Webinar-Brochures/may-7-webinar-brochure.htm.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With five worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com.
