Jan 13, 2012 
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The presentation will take place during Session TA1, titled “PB-Free Advancements” on Tuesday, February 14 at 9:30 a.m.
The intermetallic compound Cu6Sn5 is a key constituent of solder joints on copper substrates and this paper, coauthored with Nihon Superior President Tetsuro Nishimura and University of Queensland’s Associate Professor Kazuhiro Nogita, will report the results of a study on the kinetics of the transformation of this compound from the hexagonal to the monoclinic form. The volume change associated with this transformation could significantly impact solder joint reliability. The work reported was undertaken as part of a research project at the University of Queensland that was funded by Nihon Superior Co. Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
