Features:
- Can be used with 6-inch to 12 inch Wafer disk;
- Compatible with JEDEC standard, 350 × 200 × 20 (mm) and below;
- The standard nozzle can be quickly replaced according to the size of the product;
- For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
- Suitable for QFN, CSP, Flip chip/die.