Feb 19, 2024 Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards. With this recently obtained ESA qualification, ACB is currently the only PCB manufacturer able to offer HDI technology within an ESA qualified domain.
Ventec's VT-901 polyimide material offers exceptional reliability performance, meeting the demanding requirements of ACB's HDI PCB manufacturing process that adheres to ESA standards. It has a high Td of 395°C, a Tg of 250°C, and a Low-Axis CTE of 50.
Ventec manufactures all VT-901 polyimide using custom treaters equipped with advanced filtration systems and 100% Automated Optical Inspection (AOI) to ensure strict FOD-control and adherence to the IPC4101E Appendix A inspection standards for materials for space applications. The same specialized equipment is utilized to manufacture thin-core laminates that are specifically designed for the most challenging space and aerospace printed circuit board applications. ACB's advanced PCB manufacturing plant in Dendermonde, Belgium, together with Ventec's AS9100 Rev D accreditation for their manufacturing and distribution facilities, establish both firms as leaders in the supply of space and aerospace electronics.
Joachim Verhegge, ACB Belgium's Plant Director, says: “Further to our already existing ESA approval for Ventec’s VT-901 polyimide material in our Sequential Rigid and Rigid-Flex applications, we are pleased to now receive our ESA HDI technology qualification. This latest approval further reaffirms our position as a top-tier PCB manufacturer for the next generation of space programs.”
Peter Coakley, Ventec Director of Sales EMEA, commented: “We have a long-standing technology partnership with ACB, and I'm happy to support them in further strengthening their position as a leading provider of aerospace-standard PCBs. Ventec VT-901 polyimide's thermal resilience and suitability for usage in high reliability rigid and flex rigid multi-layers in the demanding aerospace sector are demonstrated by the most recent ESA approval for HDI Rigid applications.”
Ventec International is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions.
Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com.
entec International Group Co., Ltd. is a Taiwan Stock Exchange listed (TWSE:6672.TT) global supplier of advanced base materials for the PCB industry worldwide, with manufacturing and distribution facilities throughout Asia, Europe, and the US. Ventec’s range of laminates & prepregs include signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. All are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support network.
For more information, visit www.venteclaminates.com.
This press release contains projections and other forward-looking statements regarding future events or our future financial performance. All statements other than present and historical facts and conditions contained in this release, including any statements regarding our future results of operations and financial positions, business strategy, plans and our objectives for future operations, are forward-looking statements. These statements are only predictions and reflect our current beliefs and expectations with respect to future events and are based on assumptions and subject to risk and uncertainties and subject to change at any time. We operate in a very competitive and rapidly changing environment. New risks emerge from time to time. Given these risks and uncertainties, you should not place undue reliance on these forward-looking statements. Actual events or results may differ materially from those contained in the projections or forward-looking statements. Some of the factors that could cause actual results to differ materially from the forward-looking statements contained herein include, without limitation: (i) the contraction or lack of growth of markets in which we compete and in which our products are sold (ii) unexpected increases in our expenses, including manufacturing expenses, (iii) our inability to adjust spending quickly enough to offset any unexpected revenue shortfall, (iv) delays or cancellations in spending by our customers, (v) unexpected average selling price reductions, (vi) the significant fluctuation to which our quarterly revenue and operating results are subject, (vii) our inability to anticipate the future market demands and future needs of our customers, (viii) our inability to achieve new customer wins or for customer wins to result in shipments of our products at levels and in the timeframes we currently expect, (ix) our inability to execute on strategic alliances, (x) the impact of natural disasters on our sourcing operations and supply chain, and (xi) other factors detailed in documents we file from time to time with the Securities and Exchange Commission.
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