Aug 10, 2015 
Future of High Temperature Interconnection
The ELCOSINT collaborative R&D project has focussed on high temperature electronics aiming to have a significant impact on energy efficiency and the environment. Over the last 3 years the project partners Microsemi, Gwent Electronic Materials (GEM) and National Physical Laboratory (NPL) have successfully developed materials specifically designed to offer an alternative for high Pb content materials to further increase the operating temperature of electronic assemblies. The webinar will be held in the 16th September.
These materials will be suitable for operating at temperatures above 250oC utilising standard manufacturing processes which until now have been a road block for high temperature interconnects in, for example, SiC applications. The presentation will cover the material development, product demonstrators, testing and final results See https://attendee.gotowebinar.com/register/8980309965588835586
