Multitest’s Ryan Satrom to Present at BiTS 2010

Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Ryan Satrom and Valts Treibergs will present a paper titled “An Improved Characterization Technique for Contactors” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/ Mesa Hotel in Mesa, Ariz. The presentation will be held during Session 4, which will take place Tuesday March 9, 2010 at 10:30 a.m.

One of the main challenges of interconnect characterization for contact manufacturers is the replication of actual test environment conditions. Several characterization techniques test and measure brand-new probes, but these techniques fail to account for performance degradation over time. Alternative techniques test probes in a lifecycle test under lab conditions, but these methods typically do not include actual devices so the validity of the results are again questionable. The limitations of most lab characterization tests include the inability to test for several real-world variables such as solder migration, surface wear, oxidation, probe hardness, tip styles and force.

Since none of these characterization methods can accurately predict performance once a contactor is placed in an actual test environment, it is necessary to evaluate other testing options. There are two main challenges to achieving accurate real-world test conditions ? the availability of a tester/handler system, and the availability of actual devices.

By using in-house handlers and testers, and working with customers to obtain devices, Multitest is able to evaluate interconnects under conditions similar to high-volume environments.

Multitest’s in-house tester uses a four-wire resistance measurement to ensure precise and accurate readings, and has been used to cycle actual devices up to 100K cycles. Using this setup, a range of variables has been tested including probe geometry, cleaning intervals, current levels, package type, cleaning effectiveness, and force. The results and conclusions from this testing will be presented.

About Multitest

Multitest Elektronische Systeme GmbH, Rosenheim is one of the world’s leading manufacturers of test equipment for semiconductor. Under the brands Multitest, ECT Interface Products and Harbor Electronics Multitest market test handlers, contactors and ATE printed circuits boards. It has offices and branches in North America, Singapore, Malaysia, the Philippines, Taiwan, China and Thailand. Multitest has an annual turnover of greater than 100 million EURO and currently employs more than 750 people.

www.multitest.com