Feb 27, 2002 Plexus Corp. (Neenah, WI) has signed a licensing and services agreement with Tessera Technologies Inc. (San Jose, CA). The licensing agreement enables Plexus to use Tessera's chip scale packaging (CSP) and multi-chip packaging (MCP) solutions to develop and manufacture miniaturized electronic devices. In addition, Tessera will provide Plexus with design collaboration, technology support, technology transfer, and sales and marketing assistance to accelerate their customers' time to market.
"Tessera's advanced packaging technology and expertise, combined with our leading design, new product introduction and manufacturing capabilities, will enable our customers to bring products they previously thought impossible to market quickly," said Bob Kronser, vice president of technology and strategy for Plexus. "This technology can be readily applied to medical devices, implantables, optical components, wireless communications and other products where size, weight, thermal and reliability considerations are critical to product design."
"Plexus is the first electronic design and manufacturing services company to license Tessera's technology," said Nicholas Colella, senior vice president of operations for Tessera. "By partnering, we can apply our expertise in microelectronics earlier in the product development cycle, allowing us to better serve our customers in solving complex problems associated with miniaturization, portability and performance of next-generation products."
