Oct 29, 2010 
The UltraSlic™ FG stencil is the first laser-cut, solder paste stencil that has paste release performance comparable to electroform technology, yet can be cut and shipped the same day the order is placed. The UltraSlic™ FG stencil incorporates the latest advancements in stencil laser technology along with a new, cutting edge Fine Grain stencil material from Datum Alloys. Superior print performance is achieved at surface area ratios as low as 0.45.
UltraSlic™ FG stencils have lower standard deviations, higher repeatability and cleaner release of solder paste compared to other stencil technologies. A more consistent solder paste deposition, a reduction in stencil cleaning frequency, and minimized rework result in higher yields and tremendous throughput improvements.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
For more information about FCT Assembly, visit http://www.fctassembly.com.
FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil, and A-Laser. With numerous facilities in the United States, we are one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils, and precision cut parts.
At FCT Assembly, we set ourselves apart from our competitors by continuously studying new products and processes in order to uphold our reputation as a leader in technology. Our customers can always count on FCT Assembly to use the latest technology and to supply products with the highest quality.
For more information, visit http://www.fctassembly.com
