SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

Jan 24, 2012

NL930PT - a no-clean, lead-free, halogen-free pin probable solder paste.

NL930PT - a no-clean, lead-free, halogen-free pin probable solder paste.

NC676 No-Clean Solder Paste

NC676 No-Clean Solder Paste

WS159 water-soluble solder paste offers best-in-class solder spread and wetting.

WS159 water-soluble solder paste offers best-in-class solder spread and wetting.

UltraSlic™ Stencil with Nano-Coating.

UltraSlic™ Stencil with Nano-Coating.

Root Cause Analysis

Root Cause Analysis

FCT Assembly is pleased to announce that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

NL930PT is a no-clean, lead-free, halogen-free pin probable solder paste. The paste is unique in  that it is a clear residue, pin probable paste that can print down to low surface area ratios consistently. 

NC676 features best-in-class solder spread and wetting, print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. The no-clean, halogen-free paste leaves a colorless residue that is penetrable, maximizing pin testability.

WS889 is FCT’s newest lead-free water soluble solder paste. The paste provides excellent wetting on all surface finishes with consistent printing down to low surface area ratios and can be run in R/H of 30-65 percent without slump.

WS159 water-soluble solder paste offers best-in-class solder spread and wetting. It also features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. WS159 is fully cleanable, with the widest cleaning process window in its class.

SN100C Bar Solder is used in thousands of wave soldering machines around the world and has proven its reliability in products exposed to the most severe service environments. Features to be highlighted at the show include:

  • Low drossing
  • Low copper erosion
  • Shiny finish
  • Easiest maintenance of all lead-free alloys
  • Joint reliability at least equal to that of Sn63/Pb37
  • More than 1.5 billion products assembled using SN100C with no known defects

Fine Line Stencil will showcase its new UltraSlic™ Stencil with Nano-Coating. UltraSlic™ high performance stencil technology has become the preferred choice when printing assemblies with challenging miniature components. The addition of a permanent, hydrophobic nano-coating to the  UltraSlic™ stencil foil minimizes solder paste’s ability to stick to the stencil apertures and the bottom side of the foil.  Up to a 10X increase in the number of prints before cleaning the stencil is possible as well as successful printing at surface area ratios below 0.45. The addition of nano-coating to the UltraSlic™ stencil further increases the performance gap between it and any other stencil technology available today.

Representatives from FCT Assembly and Fine Line Stencil will be on hand at the show to discuss the company’s innovative Root Cause Analysis Service.  Most OEMs and CMs are periodically confronted with challenging assemblies that have low yields and have to be fixed at rework. Unfortunately, rework costs time and money, and decreases the reliability of the product. These assembly challenges will only increase as component sizes continue to decrease. OEMs and CMs can surely determine the root cause(s) of the low yields, but most don’t have the capacity, nor the time, to take on this difficult task. 

FCT Assembly developed its Root Cause Analysis Service to specifically address the need to quickly determine the root cause(s) of low yields anywhere in the assembly process and then provide a sound solution to its customers for yield improvement. This proven process can dramatically improve process yields with any assembly, regardless of complexity.

For more information about FCT Assembly’s new paste or stencil technologies, stop by Booth #612 at the IPC APEX Expo or visit www.fctassembly.com.


FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil and A-Laser. With numerous facilities in the United States, FCT is one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils and precision cut parts. The company sets itself apart from its competitors by continuously studying new products and processes in order to uphold its reputation as a leader in technology. FCT’s customers can always count on the company to use the latest technology and to supply products with the highest quality.

Mar 30, 2016 -

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Mar 29, 2016 -

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Feb 25, 2016 -

FCT to Showcase Advanced Printing Technologies at APEX 2016

Feb 24, 2016 -

Licensed Stencil Manufacturers Feature Florida CirTech’s NanoSlic Coating

Dec 04, 2015 -

Fine Line Stencil Upgrades Step Stencil Technology

Nov 17, 2015 -

FCT Assembly’s NanoSlic® Stencil Coating Recognized for its Electronics Assembly Innovation

Sep 01, 2015 -

FCT Assembly to Showcase Comprehensive Product Line and have Major Presence at SMTA International

Aug 04, 2015 -

A-Laser Helps Cardica Produce Next-Generation Medical Devices

Jun 08, 2015 -

A-Laser Expands Facility, Announces Appointment of New Operations Manager

Jun 08, 2015 -

FCT and Fine-Line Stencil Expand Market Presence with New Facility in Guadalajara, Mexico

165 more news from FCT ASSEMBLY, INC. »

Apr 30, 2024 -

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference in Denver, Colorado Opening May 28, 2024

Apr 29, 2024 -

New! Model ZM-R750 PC Controlled BGA Rework Station.

Apr 29, 2024 -

RAY TECH (MALAYSIA), UNICOMP Technology's first overseas production base officially in operation to follow Belt and Road Initiative

Apr 29, 2024 -

Aven Launches the Cyclops 4K Ultra HD Digital Microscope: Redefining Precision Viewing

Apr 29, 2024 -

SMTA Long Island Chapter Celebrates 30th Anniversary with Membership Appreciation Event

Apr 29, 2024 -

KYZEN Announces Exclusive Partnership with Manufacturers' Representative Restronics Florida

Apr 29, 2024 -

Record Numbers of Exhibitors to Showcase their Products and Services at EWPTE 2024

Apr 29, 2024 -

KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum

Apr 29, 2024 -

SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories

Apr 29, 2024 -

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

See electronics manufacturing industry news »

See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo news release has been viewed 1292 times

  • SMTnet
  • »
  • Industry News
  • »
  • See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo
SMT Spare Parts and Feeders

ICT Total SMT line Provider