SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NYSE: TER) announced that United Test and Assembly Center, Ltd. (UTAC) selected the J750Ex-HD and placed a multi-system order to support its customers' production ramps of consumer digital devices. UTAC, a long-time J750 customer, recently adopted the system's High Density (HD) instrumentation including the 128-channel HSD800 multifunction digital instrument and HD DPS (High Density Device Power Supply) instrument, extending the range of devices tested by the system and the site count scalability available to customers.

"We have installed J750 systems across most of our facilities as they offer our customers the best value for wafer sort and a broad portfolio of instrumentation for low-end consumer A/V, baseband, FPGA and microcontroller devices," said Jim Cao, Senior Vice President of Operations, UTAC. "Adding the J750Ex-HD instrumentation to our portfolio extends the range of our test coverage and increases site count which lowers test cost for our customers, enabling them to be more cost competitive in their markets."

"The J750Ex-HD increases tester throughput through higher density instrumentation while maintaining the ease of use that people expect from the J750." said Jason Zee, Consumer Business Unit Manager at Teradyne. "Adding HD instrumentation to UTAC's portfolio extends the range of devices they can test and expands their capability to deliver low-cost production test services to their customers."

Teradyne has shipped more than 4,500 750 family systems delivering the best cost-of-test economics for over 150 fabless and IDM semiconductor companies in low-cost consumer SoC markets including image sensor and microcontroller. Teradyne continuously invests in the platform to meet emerging test requirements enabling customers to increase test cell throughput with higher density instrumentation for increased site count. Most recently, Teradyne enhanced the system's infrastructure with improvements including a high-speed data link, and delivered a family of high-density instruments including a 48-channel DPS instrument, a 128-channel, 800Mbps multifunction instrument and a 72-channel converter test option. For more information on the J750, visit. www.teradyne.com/J750/.

About UTAC Holdings Ltd

UTAC Holdings Ltd (UTAC) is a leading independent provider of semiconductor assembly and testing services for a broad range of integrated circuits including memory, mixed-signal, analog, logic and radio frequency ICs. The Company offers a full range of package and test development, engineering and manufacturing services and solutions to a worldwide customer base, comprising leading integrated device manufacturers (IDMs), fabless companies and wafer foundries. UTAC operates manufacturing facilities in Singapore, Thailand, Malaysia, Indonesia, Taiwan and China, in addition to its global network of sales offices in the United States, Europe, Japan, Korea, China and Singapore.

For more information, please visit www.utacgroup.com

May 27, 2024 -

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Apr 03, 2015 -

Registration Opens for 2015 Teradyne Users Group Conference

19 more news from Teradyne »

May 29, 2024 -

Seal of Excellence: Comformal Coating for Ultimate Circuit Protection

May 28, 2024 -

Infrared (IR) Laser Cutting

May 28, 2024 -

Innovations in Rapid Prototyping: Exploring RIM and Vacuum Casting

May 28, 2024 -

The New Demo Center in Shenzhen Unicomp Plant is Officially Opened

May 27, 2024 -

KYZEN Puts Focus on Understencil and PCB Cleaners at SMTA Querétaro

May 27, 2024 -

EWPTE 2024 Draws Nearly 3,000 Attendees

May 27, 2024 -

Nordson Partnering with Circuit Technology Training for Field Service

May 27, 2024 -

PVA to Showcase New PathMaster X Software at SMTA Upper Midwest Expo & Tech Forum 2024

May 27, 2024 -

Gene Weiner, President of Weiner International Associates and Raymond E. Pritchard IPC Hall of Fame Member, will chair a special forum on UHDI and substrate manufacturing at PCB East 2024 on June 5 in

May 27, 2024 -

SMTXTRA Partners with PMR Representatives to Expand Coverage in Southern California

See electronics manufacturing industry news »

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers news release has been viewed 1764 times

  • SMTnet
  • »
  • Industry News
  • »
  • UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers
One stop service for all SMT and PCB needs

Facility Closure