Sep 11, 2023 
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Redefining Reliability and Cost Efficiency
Heraeus Electronics is revolutionizing the automotive industry with its Microbond® SMT660 Innolot® 2.0 solder alloy. This advanced solution offers an innovative approach to highly reliable and cost-effective solder alloys for automotive applications. By introducing the ability to maintain a competitive Total-Cost-of-Ownership (TCO) while meeting emerging requirements, Heraeus Electronics is setting new industry benchmarks. The next generation of Innolot® alloy enhances creep resistance, leading to extended product life cycles at higher operating temperatures. Notably, the Microbond® SMT660 Innolot® 2.0 solder paste excels in reflow without the need for additional N2, keeping defect rates low and reducing TCO.
Advancements in Flux Design for Enhanced Performance
The Microbond® SMT660 solder paste incorporates a flux designed to deliver superior performance. An acrylic-based synthetic resin eliminates potential batch-to-batch variations often associated with natural raw materials. This approach, combined with low impurities, results in a high Surface Insulation Resistance (SIR) performance, reducing the risk of electrochemical migration. This flux combined with Innolot® or Innolot® 2.0 alloy synergy offers exceptional reliability, making it especially valuable in miniaturized systems within the automotive industry.
Focus on Sinter Paste Innovations
During the event, Heraeus Electronics also will showcase its cutting-edge sinter paste innovations. The PE401 Copper Pressure Sinter Paste represents a breakthrough material for die attach applications of high-power packages. Known for forming highly reliable joints with excellent thermal conductivity, PE401 is both lead-free and devoid of halogens and nano particles.
The mAgic Pressure Sinter Paste PE338 and PE338 F1510 Sinter Pastes for stencil and screen printing improve device reliability and provide high electrical conductivity, improving device efficiency. The pastes have proven to enhance workability on copper surfaces and elevate performance longevity by integrating wide band gap materials such as SiC and GaN.
To learn more about Heraeus Electronics, visit www.heraeus-electronics.com.
The Heraeus Group is a broadly diversified and globally leading family-owned technology company, headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660. Today, Heraeus bundles diverse activities in the Business Platforms Metals and Recycling, Healthcare, Semiconductor and Electronics as well as Industrials. Customers benefit from innovative technologies and solutions based on broad materials expertise and technological leadership.
In the 2022 financial year, the group generated revenues of €29.1 billion (US$30.6 billion*) with approximately 17,200 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets.
(* calculated with 2022 average exchange rate, 1€ = 1.0530 US$)
Heraeus Electronics is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio - from materials and material systems to services.
