SHENMAO Showcasing Liquid Flux and Low Temp Solder at SMTA Guadalajara

SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.

SHENMAO’s LTS refers to the solder alloy with liquidus below eutectic Sn/Pb37 (183°C). PF735-PQ10 is a no clean, zero-halogen, low melting point, lead-free solder paste. The peak reflow temperature of PF735-PQ10 can decrease to as low as 160°C.

Package thickness is reduced as increasing demand for ultra-thin packages. In addition, the reflow temperature of SAC series solder paste is much higher than the glass transition temperature (Tg) of substrates. The warpage becomes a serious issue and generates production yield loss as combining abovementioned factors. LTS paste can reduce the reflow temperature to below 200°C and hence decrease the PCB and substrate deformation.

SM-862 is a ROL0 (J-STD-004B), tack-free, no-clean flux designed for use in a variety of automated and selective soldering applications. It is a rosin-containing flux designed to leave less residue and minimum bridges. SM-862 produces highly reliable assemblies meeting the toughest reliability requirements. It offers stable quality, good hole-fill, and excellent wettability and solderability.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.

For more information, please visit www.shenmao.com.

SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.