Seika Machinery to Present Solutions to Optimize Production Processes at APEX 2024

Seika Machinery, Inc. is gearing up to showcase its latest advancements at Booth 4012 during the 2024 IPC APEX EXPO, slated to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to excellence and technological innovation, Seika Machinery will present an array of state-of-the-art equipment and systems designed to optimize production processes and enhance manufacturing efficiency.

Among the offerings featured at the expo is the Hioki Flying Probe Tester, renowned for its ability to evaluate solder joints between lands and leads through resistance testing. With a measuring rate of 40 steps per second, this advanced tester incorporates an AOI function to verify component presence, polarity and displacement, while soft-landing probes prevent damage to boards and components. Additionally, the Hioki Flying Probe Tester boasts a minimum probing pitch of 0.15mm, facilitating fast fixture-less setup and optional Gerber data-based programming, all operated through a user-friendly Windows® 10 interface.

Seika Machinery will also showcase the Hitachi Giken Neoview, a revolutionary visual inspection support system that transcends human limitations, ensuring accuracy and consistency in inspection results. Designed to accommodate global expansion, the Neoview system addresses critical questions surrounding visual inspection, providing comprehensive solutions supported by international patents.

Additionally, the expo will feature the Malcom RCX Profiler, offering comprehensive profiling of reflow ovens, and the Malcom Spot Viscometer for Paste Printer – PCU02V, designed to measure the viscosity of solder paste for optimal soldering results.

Attendees will have the opportunity to explore the new Sawa Pallet Cleaner – SCPA2, offering all-in-one assembly, flux, wave soldering, and final product cleaning, as well as the McDry dry cabinet with Ethernet Data Logger, providing secure cloud-based data storage and monitoring capabilities.

Rounding out the exhibition are the Unitech PCB Cleaner, featuring a dual dust removal system for superior cleaning results, and the Sayaka 34XJ Inline/Stand-alone Router, delivering precise PCB depaneling and routing with exceptional accuracy and efficiency.

Seika Machinery invites attendees to visit Booth 4012 at the 2024 IPC APEX EXPO to experience firsthand the latest advancements in electronics manufacturing technology.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.