Jun 26, 2008 �Using a BGA is the most common method today for packaging a high pin-count or very dense application specific integrated circuits (ASIC) and field programmable gate arrays (FPGA). BGAs have been proved to be a reliable, cost-effective package while at the same time providing flexibility to address miniaturization and functional requirements,� said author Charles Pfeil. �However, as BGA density and pin count continue to increase, the designer�s ability to effectively design with the devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process.�
These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices.
�BGA Breakouts and Routing is a useful industry resource," said James Patten, assistant department manager, Components Design and Analysis Department, Northrop Grumman Space Technology. "The book explores BGA routing in a logical and straight-forward manner, and provides an orderly methodology while offering valuable insight into designing with these devices."
�We are proud to offer this in-depth look at the future enhancements of BGA technology,� said Dan Boncella, director of marketing, System Design Division, Mentor Graphics Corporation. �We continue to research and develop products for our customers with cutting-edge technologies providing designers with the tools necessary to enhance productivity and bring to market cost-effectively.�
To obtain a copy of BGA Breakouts and Routing, or to learn more about upcoming discussions, events and articles about BGAs and Mentor�s solutions to automating the design process for these complex, leading edge packages, visit, http://www.mentor.com/go/bga or contact Charles directly at bga_info@mentor.com .
About Charles Pfeil
Charles is an engineering director at Mentor Graphics, System Design Division and was the original product architect for the Expedition� PCB software and one of the inventors of XtremePCB and XtremeAR software tools. Charles has worked in the PCB industry for over 40 years as a designer, owner of a service bureau, and has worked in marketing and/or engineering management with prominent leaders in the EDA companies. In addition, Charles is a consistent contributing author to industry publications discussing trends and technologies in PCB design as well as a regular participant in industry workshops and seminars.
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world�s most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of over $850 million and employs approximately 4,200 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.
Mentor Graphics and Expedition are registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)
