Mar 13, 2008 Lead-free solder can cause many circuit testing problems. It has a higher reflow temperature, which can result in harder and stickier solder flux resin and a thicker, harder oxide layer. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Additionally, lead-free solder resin and oxides can increase debris transfer to spring probes. These are many of the issues found in OSP and no-clean applications. As a result, ECT has developed the Lead-Free POGO Series, a new test probe series, specifically designed to solve these problems.
ECT�s new lead-free probe line incorporates numerous features that will significantly reduce the issues that arise when switching to lead-free solder as well as those contact issues that arise with OSP and no-clean solder flux.
New Proprietary Plating � The new lead-free probe incorporates a new harder and slicker plating that not only resists wear but also reduces solder and debris transfer.
Higher Preload � All of the new lead-free probes incorporate higher preloads to reduce spring force variation with board flex and increase the initial impact penetration, resulting in higher first pass yields.
PogoPlus Bias Ball Design � The PogoPlus internal bias ball design guarantees uninterrupted electrical contact with the probe sidewall, virtually eliminating probe-related false opens.
Range of Spring Force Choices � Compared to competitors� products, which offer limited spring force options, ECT�s LFRE Pogos are available in a variety of spring force choices in 100, 75 and 50 mil centers.
Spring Life � All of ECT�s LFRE probes have a spring fatigue life that surpasses 500,000 cycles. Competitors� lead-free products may increase preload but dramatically lower cycle life, in some cases, at or below 50,000 cycles.
Pointing Accuracy � ECT�s new lead-free probe incorporates a double roll close, which offers the industry�s best pointing accuracy. Increased pointing accuracy is beneficial when using lead-free solder and/or no-clean because the probe is less likely to touch the edge of the pad where the solder flux accumulates.
A variety of LFRE tip styles give users the flexibility to meet application needs. Additional benefits include probe tips, manufactured with ECT�s MicroSharp� technology, offer the ultimate in long-lasting tip sharpness and contact integrity; a double-roll close offers the industry�s best pointing accuracy, helping users hit the smallest test targets with high repeatability; a shorter plunger permits more spring volume, higher spring force and longer spring life; and ECT�s precious metal plating process, together with enhanced bias contact, provides highly repeatable conductivity.
Everett Charles Technologies, a Dover Corporation company, is a leading manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, POGO� test contacts, backplane and loaded PCB test fixtures. Corporate manufacturing, service, and support facilities are ISO registered with locations in the United States, Europe and Asia. The company has been awarded numerous patents and participates actively in developing industry standards. Additional information is available at http://www.ectinfo.com.
