Aug 27, 2003
- IPC-0040, Optoelectronic Assembly and Packaging Technology
This ANSI-approved document addresses the implementation of optical and optoelectronic packaging technologies and covers technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics and the manner in which these parts will become an integral part of the functioning module, board or subassembly.
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IPC-WP-006, Round Robin Testing and Analysis: Lead Free Alloys�Tin, Silver, and Copper
This 19-page paper summarizes a round robin test program on the assembly properties of three lead free solder alloys. Melt characterization, wetting balance responses and solder spread tests were performed by IPC Solder Products Value Council members on the three tin-silver-copper alloys in the following percentages respectively: 96.5/ 3.0/ 0.5; 95.5/ 3.8/ 0.7; and 95.5/ 4.0/ 0.5. The white paper includes examples of statistical analysis, data analysis of the tests, data tables of testing participants and a reproduction of IPC test methods used.
IPC-ROADMAP-03, 2002/2003 National Technology Roadmap for Electronic Interconnections
This document provides vision and direction for product development, process development and services required to satisfy the current and future needs of U.S. companies that are building electronic and optoelectronic equipment. The Roadmap presents findings and recommendations based on OEM requirements and an updated cost model that considers circuit density (for board fabrication) and assembly complexity (for assembly manufacture). It also encompasses the supply chain infrastructure needed for single chip and multichip packaging, printed board issues, assembly considerations, optoelectronics and related management/environmental key pressure points.
IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Boards
Used in conjunction with IPC-2221A, this standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and its forms of component mounting and interconnecting structures. It provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI-advanced IC interconnection substrates.
IPC-8413-1, Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
This specification defines standard practices for handling various kinds of optical fiber and the specifications and guidelines to be used in the design of carriers for these fibers in component manufacturing. This standard does not define a particular carrier design, but does define enough parameters to facilitate the use of fiber carriers in optoelectronic component manufacturing, particularly in automated or semi-automated processes.
To receive a free 2003-2004 IPC Publications Catalog, download a copy at http://www.ipc.org/onlinestore or contact IPC Receptionist Lucy Barnish at LucyBarnish@ipc.org or 847-790-5301.
About IPC
IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit http://www.ipc.org.
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