Topics to be covered include:
- SnPb with Lead-Free Components
- Reliability
- Harsh Environment
- Tin Whiskers
- New Alloys
- Electromigration
- Thermal dissipation
- Manufacturing Process
- Package on Package
- Advanced Packaging
- Halogen-Free Laminates
- High Density Interconnects
- Thermal Interface Materials
- Underfill
200-300 word abstracts should be submitted to Melissa Serres Marx at melissa@smta.org or on-line at http://www.smta.org/education/education.cfm#toronto by January 16, 2009. Include a title, author name and contact information with your abstract. Technical papers are required for this event and will be due on April 7, 2009.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.