May 10, 2002 Rosemont, IL
The Surface Mount Technology Association (www.smta.org) will sponsor a special symposium on lead-free processing during its annual conference this fall. Implementation and reliability of electronics with lead-free solder will be emphasized.
Paper sessions, four in all, will address materials performance, solderability, assembly processing, and the effects of contamination on reliability, including the role of nitrogen, the effects of copper and lead contamination, and characterizing lead-free solder paste performance.
A panel made up of the primary consortia investigating lead-free solder technology will round out the symposium. Panelists include Dr. Carol Handwerker of NIST (Nemi lead-free project); Dr. Prasad Swaminath of ChipPac (Nemi tin whisker project); Brian Green of Nasa (JG-PP-10 military lead-free project); and Dr. Tsung-Yu Pan of Ford (NCMS high-temperature, fatigue-resistant solder project). Dr. Ning-Cheng Lee of Indium Corp. and Dr. Hans-Juergen Albrecht of Siemens will also participate.
SMTA International takes place Sept. 22-26 at the Donald Stephens Convention Center in Rosemont, IL.
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