News Releases from Kester
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- News Releases from Kester
54 news releases added by Kester
Company Information:
Kester to Exhibit at IPC APEX EXPO 2020
Jan 15, 2020 | Kester will be exhibiting (booth #818) at IPC APEX Expo 2020.
Kester Launches NP505-LT Solder Paste
Jan 10, 2019 | NP505-LT is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components.
Kester to Exhibit and Present at SMTA International 2018
Oct 09, 2018 | Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL.
Kester Launches WP616 Solder Paste
Sep 07, 2018 | Kester is proud to announce the launch of WP616, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition.
Kester Launches WP616 Solder Paste
Sep 07, 2018 | Kester is proud to announce the launch of WP616, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition.
Kester Launches NP560 Solder Paste
Mar 12, 2018 | Kester is proud to announce the launch of NP560, a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
Kester to Exhibit and Present at IPC APEX EXPO 2018
Jan 30, 2018 | Kester will be exhibiting (booth #3118) at IPC APEX Expo 2018, which will take place February 27-March 1 at the San Diego Convention Center. Kester’s booth will offer attendees the opportunity to meet with the R&D and sales teams, and learn more about Kester’s new products.
Kester to Exhibit & Present at SMTA China East/NEPCON China
Apr 10, 2017 | Kester will be exhibiting (booth #1H43) at SMTA China East/NEPCON, which will take place April 25-27 at the Shanghai World Expo Exhibition & Convention Center. Kester’s booth will offer attendees the opportunity to meet with the sales team and learn more about Kester’s new products.
Kester to Exhibit at SMT Hybrid Packaging 2017
Apr 04, 2017 | Kester will be exhibiting (booth # 4-533), at SMT Hybrid Packaging 2017, which will take place May 16-18 at the Exhibition Centre in Nuremberg, Germany.
Kester to Present at SNEC 11th (2017) International Photovoltaic Power Generation Conference & Exhibition
Mar 31, 2017 | Kester’s Dr. Yanrong Shi will present “Insights of solder flux fundamentals in solar module assembly” on Thursday, April 20 at 3:00pm at SNEC 11th (2017) International Photovoltaic Power Generation Conference & Exhibition. SNEC will take place April 18-20, 2017 in Shanghai.
Kester Launches WP601-ZH Solder Paste
Mar 13, 2017 | Kester is proud to announce the launch of WP601-ZH, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP601-ZH is a breakthrough in water-soluble solder paste technology, providing a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation.
Kester To Present at the SMTA South East Asia Technical Conference on Electronics Assembly
Mar 10, 2017 | On Wednesday, March 29 Kester’s Bruno Tolla and Kyzen’s Mike Bixenman will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” at the SMTA South East Asia Technical Conference on Electronics Assembly.
Kester to Participate in SMTA Panel Discussion
Mar 08, 2017 | On Wednesday, March 15 Kester’s Senior Field Applications Support Engineer, Mike Kaminsky, will be part of the SMTA Space Coast Chapter Panel Discussion on "Avoiding the Voids in Reflow Soldering".
Kester To Exhibit at Upcoming SMTA Texas Expos
Mar 02, 2017 | Kester will be exhibiting at SMTA Dallas Expo & Forum (booth #416) on Tuesday, March 7 at the Plano Centre in Plano, TX. On Thursday, March 9 Kester will exhibit again at the SMTA Houston Expo & Tech Forum (booth #64) which will take place at the Stafford Centre in Stafford, TX.
Kester To Exhibit at Upcoming SMTA Texas Expos
Mar 02, 2017 | Kester will be exhibiting at SMTA Dallas Expo & Forum (booth #416) on Tuesday, March 7 at the Plano Centre in Plano, TX. On Thursday, March 9 Kester will exhibit again at the SMTA Houston Expo & Tech Forum (booth #64) which will take place at the Stafford Centre in Stafford, TX.
Kester Wins Circuit Assembly’s 2017 NPI Award
Feb 28, 2017 | Kester was awarded Circuit Assembly’s 2017 New Product Introduction (NPI) Award in the category of Flux for SELECT-10™ Selective Solder Flux. The award was presented during the IPC APEX EXPO 2017.
Kester to Host Technical Rework Seminar
Feb 21, 2017 | Kester is hosting a Technical Rework Seminar, scheduled to take place Tuesday, March 7 at Kester’s Global Headquarters in Itasca, IL.
Kester to Exhibit and Present at IPC APEX Expo 2017
Jan 17, 2017 | Kester will be exhibiting (booth #2205) at IPC APEX Expo 2017, which will take place February 14-16 at the San Diego Convention Center. Kester’s booth will offer attendees the opportunity to meet with the R&D and sales teams, and learn more about Kester’s new products.
Kester Launches SF855-LR Soldering Flux
Nov 14, 2016 | Kester is proud to announce the launch of SF855-LR Soldering Flux, a low solid, low residue, no-clean non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) through soldering tabs to cell contacts. The extremely low solids content (1.6%) and nature of the activator system results in practically no residue left on the cell after soldering. SF855-LR has a wide operating window and temperature range, and can be used in SnPb, SnAgPb and Pb-free applications.
Kester to Present at IPC-SMTA Cleaning and Conformal Coating Conference: Building Reliable Hardware
Oct 14, 2016 | Kester will be presenting at the IPC-SMTA Cleaning and Conformal Coating Conference: Building Reliable Hardware, which will take place October 25-27, 2016 at the Hyatt Rosemont, in Rosemont, IL.
Kester to Present During Design - Cleaning - Reliability Webinar
Oct 07, 2016 | Kester will be part of a free live webinar, “QFN: Design - Cleaning - Reliability: What you can't see can cause failure!”, on Thursday, October 13. Kester’s Global R&D Director, Bruno Tolla, Ph.D., will be a panelist in partnership with Kyzen, Plexus and STI Electronics.
Kester Launches New Website
Sep 21, 2016 | Kester is proud to announce the launch of our new website. Please visit our upgraded website, which provides a responsive and overall more user friendly experience for all visitors, at www.kester.com.
Kester to Exhibit and Present at SMTA International 2016
Sep 08, 2016 | Kester will be exhibiting (booth #500) at Surface Mount Technology Association International (SMTAI) 2016, which will take place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.
Kester Hosted Successful Advanced Selective Soldering Process Seminar
Jul 12, 2016 | Kester hosted an Advanced Selective Soldering Process Seminar, on June 28 at their Global Headquarters in Itasca, IL.
Kester Hosted Successful Advanced Selective Soldering Process Seminar
Jul 12, 2016 | Kester hosted an Advanced Selective Soldering Process Seminar, on June 28 at their Global Headquarters in Itasca, IL.
Kester to Host Advanced Selective Soldering Process Seminar
Jun 21, 2016 | Kester is hosting an Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28 at Kester’s Global Headquarters in Itasca, IL.
Kester Launches NF372-TB Flux-Pen® and RF550 Rework Flux
Apr 28, 2016 | Kester is proud to announce the launch of NF372-TB Flux-Pen® and RF550 Rework Flux. These products were formulated to compliment Kester’s high-reliability, no-clean product line.
Kester Launches SELECT-10™ Selective Solder Flux
Apr 22, 2016 | Kester is proud to announce the launch of SELECT-10™Selective Solder Flux, a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. As part of Kester’s portfolio of high reliability products, SELECT-10™ has passed IPC SIR testing as a raw and partially activated flux. Sustained activity within the flux allows for good barrel fill in challenging and high temperature applications. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10™ is classified as ROL0 flux under IPC J-STD-004B.
Kester to Exhibit and Present at SMTA China East 2016 Technology Conference & NEPCON China
Apr 18, 2016 | Kester will be exhibiting together with Speedline and Vitronic Soltec (booth # 1G40, Hall 1) at SMTA China East Conference 2016 which will be held in conjunction with NEPCON China 2016 in Shanghai on April 26-28.
Kester to Exhibit at SMT Hybrid Packaging 2016
Apr 18, 2016 | Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.
Kester to Exhibit at the 20th Annual Atlanta SMTA EXPO
Apr 11, 2016 | Kester will be exhibiting together with Gardner & Meredith at the 20th Annual Atlanta SMTA EXPO, which will take place on April 20 at the Infinite Energy Center (formerly Gwinnett Center) in Duluth, GA.
Kester’s Peter Biocca to Chair AOI and X-Ray Inspection Technical Session at SMTAI 2010
Oct 04, 2010 | Kester announces that Peter Biocca, Senior Market Development Engineer, will Co-Chair Session PRC2, titled “Strategies for Optimizing AOI and X-Ray Inspection” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The session will take place Wednesday, October 27, 2010 from 10:30 a.m.-12 p.m. in room Europe 1.
Kester Receives ISO 9001:2008 Certification
Mar 26, 2010 | ITASCA, IL - Kester announces that its facility in Itasca, IL has received a certificate of registration for the International Standard AS9120:2002-10, ISO 9001:2008.
Kester to Showcase NXG1 No-Clean Paste at SMTA Atlanta Expo & Tech Forum
Mar 24, 2010 | ITASCA, IL - Kester announces that representative Gardner & Meredith will showcase its NXG1-HF, a lead-free no-clean solder paste, at the upcoming SMTA Atlanta Expo and Tech Forum, scheduled to take place Thursday, April 15, 2010 at the Gwinnett Civic Center in Duluth, GA.
Kester to Host Solder Alloy Task Group at IPC Midwest 2009
Aug 27, 2009 | ITASCA, IL — August 2009 — Kester announces that David Scheiner will host a Solder Alloy Task Group at the upcoming IPC Midwest Conference. The meeting will be held during Session 5-24c of the Standards Development Meetings, scheduled to take place Tuesday, September 22, 2009 from 1:30- 3 p.m.
Kester Appoints Experienced Technology Manager to Solder Paste R&D
Jul 28, 2009 | ITASCA, IL — July 2009 — Kester is pleased to announce appointment of Adrian Hawkins, Ph.D., to the role of Technology and Development Manager. Adrian’s primary responsibility will be to lead the Research & Development for Solder Paste in North America.
Kester Announces Approval of FL250D No-Clean Paste by Leading Network Equipment Company
May 01, 2009 | ITASCA, IL � April 2009 � Kester announces that its FL250D no-clean solder paste has been added to the global approved materials list of a leading network equipment company due to its excellent properties in terms of eliminating/preventing head-in-pillow defects.
Kester's Peter Biocca to Present at SMTA Atlanta 2009
Apr 13, 2009 | ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta
Apr 13, 2009 | ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Kester Successfully Completes Headquarters Expansion Project
Mar 18, 2009 | ITASCA, IL � March 2009 � Kester announces that it recently completed an expansion project at its Itasca, IL headquarters facility to dedicate more floor space to Solder Paste and Tacky Soldering Flux products.
Kester's David Scheiner to Hold Task Group at APEX 2009
Mar 06, 2009 | ITASCA, IL � March 2009 � Kester is proud to announce that David Scheiner will hold a Solder Alloy Task Group at the upcoming APEX Conference and Exhibition, during Session 5-24c of the Standards Development Meetings, scheduled to take place on Monday, March 30, from 1:30-3 p.m.
Kester to Participate in Technical Conference at APEX 2009
Mar 05, 2009 | ITASCA, IL � March 2009 � Kester is proud to announce that Peter Biocca and David Scheiner will hold a technical session titled �PCB Metalization� at the upcoming APEX Conference and Exhibition. Biocca, Kester's Senior Market Development Engineer, will be the moderator at the conference, which is scheduled to take place on Wednesday, April 1, from 10:15�11:45 a.m. in the South Pacific room.
Kester Celebrates 110 Years in Business
Feb 11, 2009 | ITASCA, IL � February 2009 � Kester announces 110 years in business as a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets.
Kester Appoints Assembly Solutions as Representative
Jan 22, 2009 | ITASCA, IL � January 22, 2009 � Kester announces that it has formally named Assembly Solutions as its representative for the territories of Washington, Oregon and northern Idaho effective February 1, 2009.
Steve Santangelo Joins Kester's North American Paste Business Unit
Oct 13, 2008 | ITASCA, IL � October 2008 � Kester announces the addition of Stephen Santangelo to the Kester Solder Paste Business Unit in North America, which is located in Itasca, Ill.
Kester to Participate in 2008 IMPACT/EMAP Conference
Oct 07, 2008 | ITASCA, IL � October 2008 � Kester announces that it will present during the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP), which will be held as a joint conference in conjunction with the TPCA Show at the Taipei Nangang Exhibition Center from October 22-24, 2008.
Kester's David Scheiner to Chair Solder Alloy Task Group During IPC Midwest 2008
Sep 15, 2008 | ITASCA, IL � September 2008 � Kester announces its participation in the Solder Alloy Task Group to be held during the IPC Midwest Conference & Exhibition in Schaumburg, IL.
Kester Appoints Floritronics as Representative
Sep 02, 2008 | ITASCA, IL � September 2, 2008 � Kester announces that it has formally named Floritronics as its representative for the state of Florida effective September 1, 2008.
Kester Introduces EnviroMarkTM 923 Lead-Free Halogen-Free No-Clean Solder Paste at NEPCON China, Shanghai.
Apr 07, 2008 | ITASCA, IL � February 29, 2008 � Kester announces it will showcase EnviroMark 923 (EM923), a halogen-free, RoHS Compliant lead-free no-clean solder paste, in booth 2C04 at the upcoming NEPCON China/EMT China 2008 exhibition and conference -scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Kester to Participate in Technical Activities During APEX 2008
Mar 20, 2008 | ITASCA, IL � March 2008 � Kester will provide lead-free soldering products, lead-free resources and technologies in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas. Kester will present its latest lead-free soldering products and technologies for lead-free wave, selective and hand-soldering applications.
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