Mar 12, 2026 PEMTRON, an inspection equipment developer and supplier, will exhibit at Smart SMT & PCB Assembly 2026, taking place April 1-4 in Korea, where it will showcase its latest AI-powered 3D inspection technologies at Booth #E132. The company will highlight the JUPITER 3D X-ray Inspection System, ATHENA 3D AOI, EAGLE 3D 8800 TWIN, and TROI 8800 CI Series, demonstrating a complete inspection portfolio designed to enhance quality, throughput, and process visibility across modern electronics manufacturing lines.
The JUPITER 3D X-ray Inspection System provides both 3D and 2D inspection using PCT reconstruction-based processing. The system integrates high-resolution imaging with PEMTRON’s AOI defect detection algorithms to support in-line process monitoring and process analysis. JUPITER also enables data sharing with SPI and AOI systems, giving manufacturers clearer insight into process trends and production stability.
PEMTRON will also showcase the ATHENA 3D AOI System, which incorporates AI-based inspection capabilities such as automatic judgment, auto-teaching, and OCR. ATHENA’s 12-way projection design reduces shadowing and supports accurate 3D measurement, while simultaneous 2D and 3D inspection enables detailed analysis at resolutions down to 10 microns. An optional 12MP camera and three-stage conveyor help maximize inspection speed and throughput.
For conformal coating inspection, PEMTRON will feature the TROI 8800 CI Series, which combines AI-driven inspection with advanced hardware design. The system’s deep learning engine is trained to identify coating-related defects such as cracks, voids, and internal bubbles with a high degree of consistency. Automated teaching functions reduce setup time and support faster changeovers, making the 8800 CI well suited for high-mix production environments.
Rounding out PEMTRON’s 3D AOI lineup is the EAGLE 3D 8800 TWIN, a top-and-bottom double-sided 3D AOI system. The TWIN platform enables simultaneous inspection of both sides of an assembly, providing complete coverage for double-sided boards. An upgraded inspection head improves 3D image stability and accuracy, helping manufacturers streamline double-sided AOI processes while improving overall inspection efficiency.
Visitors to Booth #E132 will have the opportunity to experience how PEMTRON’s integrated inspection ecosystem supports smarter manufacturing, improved quality control, and data-driven process optimization.
For more information about PEMTRON, please visit www.pemtron.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
