Oct 06, 2010 
ORPRO Vision’s range of AOI systems comprises the Symbion series of post-paste and post-soldering systems.
Symbion S36 features the advanced DPIX™ (Dimensional Picture Image eXtraction) technology that ensures superior detection accuracy with minimized false calls. A specialized, stationary 3-D optical head employs a series of high performance cameras - one top and four angled for primary inspection.
With a total of 95 images taken per field of view, the result is the most complete and reliable image of each component.
The Top camera is 4 MP and it’s supported by side cameras with XGA resolution.
A moving z-axis table and automatic board warpage compensation further support the system’s optimal imaging of all board types, regardless of geometries or background variations.
Unlike other paste inspection solutions that have to compromise on either speed or resolution, Symbion P36 Plus’ patented POP (Parallel Optical Path) technology employs a revolutionary approach to inspection that achieves the very highest resolution at or above line speed.
POP utilizes an optimized scanning technique with two scan lines operating simultaneously via independent optical channels for 3-D and 2-D image acquisition.
This enables 100% full board coverage and precise measurements of solder paste deposit volume, area, shape, and location.
Orpro Vision’s unique 3-D laser triangulation method provides a clear, angled view for solder paste height mapping at the fine resolution of 5 μm.
A true 2-D laser illumination channel ensures excellent top views of the solder paste at 20 x 20 μm resolution.
ORPRO Vision is looking forward to events like SMTAI to meet customers and to elucidate them on the latest developments of its AOI technology.
For more information: http://www.orprovision.com
