SMT, PCB Electronics Industry News

Nepcon Shanghai 2010 a great success

Apr 28, 2010

At this year’s Nepcon Shanghai trade show the SIPLACE team received two highly influential and prestigious awards for the new SIPLACE SX: the EM Innovation Award China and the SMT China Vision Award. Receiving both of these awards for the third time running is a sign of the SIPLACE machines’s high degree of development, since the independent award panels honor only highly innovative products. The SIPLACE SX impressed the panelists mainly with its extremely flexible Capacity-on-Demand concept and its changeable gantries. Apart from the award juries, many visitors to the SIPLACE booth in Shanghai awarded top grades to the new machines as well, as expressed by Mr. Fuhao of Foryou General Electronics Co., Ltd.: “Thanks to its modular gantries, the SIPLACE SX is the best solution for short-term order peaks. It also enables us to individually adapt the capacity of our lines by shifting gantries between them, which is a particularly attractive feature for us.” And Mr. Ou Kai, SMT manager of FiberHome Technologies, added: “The SIPLACE SX is exactly the right machine for our requirements. It allows us to invest precisely in what we actually need. It meets all our requirements in terms of economic efficiency.”

The many international awards for the SIPLACE SX, which previously received the Global SMT & Packaging Award at last year’s Productronica, confirm the innovative strength and quality of SIPLACE placement machines. Andy Wen, head of the SIPLACE team in China, is proud of these accomplishments: “We are very grateful for these new awards. They are a motivation as well as an incentive for the entire SIPLACE team and affirm our endeavor to develop technologically leading solutions of the highest quality for our customers. With the SIPLACE SX and its Capacity-on-Demand concept, we make sure that our customers always receive a cost-effective solution that works best for their specific production requirements.” The SIPLACE SX is the world's first placement machine that allows the user to add or remove a gantry in less than 30 minutes. In combination with the SIPLACE X-Series it provides an ideal end-of-line addition.

About the Awards

Established in 2006, the EM Asia Innovation Award has honors outstanding performance in the Asian electronics market. It encourages companies in the region to continually strive for excellence and meet the highest standards. The winners are selected by an independent panel of industry experts based on the following categories: innovation, cost efficiency, speed and performance improvement, quality, ease of use, maintenance requirements, and technological advancement.

http://www.emasiamag.com/awards2010/

The SMT China Vision Award, which is also presented by an independent panel of industry experts as well as by readers of SMT China, differentiates between the following categories: creative use of new and existing technologies, total quality, performance continuity, economic value, degree of innovation, cost efficiency, speed and performance improvement, quality, ease of use, maintenance requirements, and environmental compatibility.

http://www.smtchinamag.com/Visionawards2010/

For more information about the SIPLACE SX, visit our website at http://www.siplace.com.

Nov 25, 2013 -

SIPLACE: Successful Productronica 2013 trade show

Mar 11, 2011 -

Lengths of up to 910 mm: SIPLACE SX sets new placement standards for unusual board sizes

Jan 10, 2011 -

SIPLACE team becomes ASM Assembly Systems

Dec 13, 2010 -

Global SIPLACE customer survey: New SIPLACE SX platform has a positive impact on customer satisfaction

Sep 22, 2010 -

Radarsensor manufacturer InnoSenT produces on SIPLACE SX equipment

Sep 22, 2010 -

Fundacao CERTI Invests in SIPLACE SX Technology

Jun 23, 2010 -

NOTE UK leading the way in Package on Package through Siplace technology

Jun 23, 2010 -

Siegfried Neubauer returns to SIPLACE headquarters

Jun 23, 2010 -

Automotive supplier AW Europe invests in new SMT lines

Jun 18, 2010 -

SIPLACE and Mentor Graphics cooperate to deliver state of the art integration value

60 more news from Siemens Process Industries and Drives »

May 29, 2024 -

Seal of Excellence: Comformal Coating for Ultimate Circuit Protection

May 28, 2024 -

Infrared (IR) Laser Cutting

May 28, 2024 -

Innovations in Rapid Prototyping: Exploring RIM and Vacuum Casting

May 28, 2024 -

The New Demo Center in Shenzhen Unicomp Plant is Officially Opened

May 27, 2024 -

KYZEN Puts Focus on Understencil and PCB Cleaners at SMTA Querétaro

May 27, 2024 -

Nordson Partnering with Circuit Technology Training for Field Service

May 27, 2024 -

PVA to Showcase New PathMaster X Software at SMTA Upper Midwest Expo & Tech Forum 2024

May 27, 2024 -

Gene Weiner, President of Weiner International Associates and Raymond E. Pritchard IPC Hall of Fame Member, will chair a special forum on UHDI and substrate manufacturing at PCB East 2024 on June 5 in

May 27, 2024 -

SMTXTRA Partners with PMR Representatives to Expand Coverage in Southern California

May 27, 2024 -

KYZEN to Focus on Two AQUANOX Chemistries at SMTA Upper Midwest Expo & Tech Forum

See electronics manufacturing industry news »

Nepcon Shanghai 2010 a great success news release has been viewed 745 times

Void Free Reflow Soldering

Solder Paste Dispensing