SMT, PCB Electronics Industry News

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NYSE:TER) announced today that it has acquired substantially all of the assets of Avionics Interface Technologies, LLC, a leading provider of equipment for testing state-of-the-art avionics data buses. The Avionics Interface Technologies (AIT) business will be operated as an independent division within Teradyne's Defense and Aerospace business unit, and will continue to provide exceptional products to existing and new customers.

AIT offers a well-established series of testing solutions for both the commercial aerospace and defense industries, including MIL-STD-1553A/B, MIL-STD-1760E, Fibre Channel, ARINC 429, ARINC 615, ARINC 615A and ARINC 664p7. "AIT's products complement Teradyne's line of bus test instrumentation, allowing Teradyne to provide complete test solutions for today's avionics systems," said John Wood, Vice President and General Manager of Teradyne's Defense and Aerospace business unit.

"The combination with Teradyne creates unparalleled technical expertise in databus testing, which will strengthen our products and support," said Bill Fleissner, President and General Manager of AIT. "AIT will continue to offer our products to simulation, test and embedded applications, and combined with Teradyne, will allow us to provide more comprehensive solutions to all of the customers we serve."

About AIT
AIT is headquartered in Omaha, Nebraska, with a production and design center near Wright Patterson AFB in Dayton Ohio. The company has distribution and support offices worldwide and is a leading designer and manufacturer of high-performance test instrumentation, flight modules, simulation modules, embedded solutions, databus analyzers, and related support systems. For more information, visit www.aviftech.com.

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 -

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Apr 03, 2015 -

Registration Opens for 2015 Teradyne Users Group Conference

Apr 03, 2015 -

Teradyne Showcases Solutions for Integrated Lab and Production Test at SEMICON China 2015

18 more news from Teradyne »

May 20, 2024 -

Saki Set to Highlight Cutting-Edge Inspection Technology at SMTConnect 2024

May 20, 2024 -

TRI opens New Manufacturing Facility

May 20, 2024 -

Altus Adds PVA's Game Changing PathMaster X Software to Portfolio

May 20, 2024 -

Europlacer to Host High-Mix Productivity Open Days in France

May 20, 2024 -

Electronics Industry Sentiment Falls in May After Hitting New High Last Month

May 20, 2024 -

Kurtz Ersa Announces Next VERSAFLOW 4 – Level ll Maintenance and Application Training Courses

May 20, 2024 -

SMTO ENTERS NEW PARTNERSHIP WITH ESSEMTEC FOR MEXICO

May 20, 2024 -

ZESTRON Announces Upcoming Webinar on Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment

May 20, 2024 -

Hanwha Techwin Features Aven Video Inspection Technology at Cypress Center of Excellence

May 20, 2024 -

Amtech Celebrates First Anniversary of "Hardware Is Forever" Podcast: Your Source for Expert Insights in Electronics Manufacturing

See electronics manufacturing industry news »

Teradyne Acquires Avionics Interface Technologies news release has been viewed 1458 times

Global manufacturing solutions provider

Software for SMT