Feb 07, 2003
The sessions covered current and emerging technologies, including ENIG, electroless gold, immersion silver, immersion gold (direct on copper), electrolytic coppers, and copper etching systems.
Tyco, Sanmina, Photocircuits, Endicott Interconnect Technologies, Alternate Finishing, Tech Circuits, Brookhaven National Labs were among the companies in attendance. Others included guests from C. Uyemura � Japan�s Central Research Labs and EMX in Richmond Hill, Ontario.
The seminar was held at UIC�s facilities in Connecticut. UIC holds occasional seminars on technical matters; contact the company for more details.
»
