Oct 26, 2008 ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dave Adams (Session Chair) of Rockwell Collins, Lee Flasche of Delphi Electronics Group, Dr. Ning-Chen Lee of Indium Corporation, Steve Hugh of Philips Medical, and Dr. Ken Dishart formerly of DuPont will present in Session 4 on Lead-Free Cleaning. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008
Higher solidus temperature and the stiffer nature of lead-free solders create problems for no-clean flux soldering materials. The increased amounts of tin oxides associated with lead-free solders require increased flux activity. These complexities create cleaning effects that render the process increasingly difficult. The level of lead-free flux residue will be greater and more noticeable. At higher peak reflow temperatures, the residue is harder to clean.
Lee Flasche will discuss lead-free soldering rework and repair. Dr. Ning-Chen Lee of Indium Corporation will discuss lead-free flux technology and the influence on cleaning. Steve Hugh of Philips Medical will discuss lessons learned from qualifying a lead-free process for medical electronics. Dr. Ken Dishart will discuss Hansen Solubility Parameters to match the cleaning material to the lead-free flux residue.
For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.
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