Apr 08, 2008 The symposium will focus on all classes of high reliability and high performance electronics assembly and will include case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries.
IPC and SMTA are currently requesting abstracts of approximately 300 words that summarize technical and previously unpublished, non-commercial work covering case histories, research and discoveries. Abstracts must be received by May 5, 2008. Preference will be given to submissions for papers in high reliability (including medical, military, automotive, aerospace, and telecommunications) and high volume production segments such as information technology. Submissions are sought on cleaning in the following areas or other related areas:
- Future Cleaning Challenges
- Cleanliness Assessment
- Cleaning Requirements
- Class 3 Cleaning Process
- No-Clean Process
- Spot Cleaning
- Cleaning for Conformal Coating
- Cleaning Agent Compatibility
- Constraints (for alloys, labels, components and board materials)
- Reflow Heat Gradients
- Environmental Issues
- Process Integration
- Cleaning Standards
Submit your conference abstract online to IPC at: http://www.ipc.org/IPCSMTAConferenceCFP , or to SMTA at: http://www.smta.org/education/education.cfm#cleaning
For more information about conference participation or registration, contact Jean Hebeisen at: JeanHebeisen@ipc.org , or Melissa Serres at: Melissa@smta.org
IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
The SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Upcoming SMTA Educational Opportunity:
3D/SiP Advanced Packaging Symposium Washington Duke Inn & Golf Club, Durham, NC April 28-30, 2008
Visit smta.org/education/symposia/symposia.cfm#ap for more information.
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