Jan 07, 2015 The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
The winner from SMTA International 2014 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Chrys Shea, Shea Engineering, for her presentation entitled "The Effects of Stencil Alloy, Tension and Cut Quality on Solder Paste Print Performance," co-authored by Ray Whittier, Vicor Corporation.
Paul Vianco, Ph.D. from Sandia National Labs won the Best of Proceedings category for the paper "Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder." Co-authors include J. A. Rejent, A. C. Kilgo, and S. E. Garrett, Sandia National Laboratories.
Polina Snugovsky, Ph.D., Celestica Inc. and Stephan Meschter, Ph.D., BAE Systems, won the Best International Paper category for the paper entitled "Strategic Environmental Research and Development Program Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies." Co-authors include Jeff Kennedy, Zohreh Bagheri, and Eva Kosiba, Celestica Inc. This award and the Best of Proceedings are selected by the SMTA International Technical Committee.
A new award category, Best Student Presentation, was awarded to Jie Gong, Ph.D., Georgia Institute of Technology, for his paper “Non-Destructive Evaluation of Solder Bump Quality Under Mechanical Bending Using Laser Ultrasonic Technique.” Co-authors include Charles Ume, Ph.D., Georgia Institute of Technology; Kola Akinade, Ph.D., Bryan Rogers, Cherif Guirguis, David Chan, and Cesar Escobar, Cisco Systems Inc.
The authors will formally be presented their awards at the Opening Ceremony during SMTA International on September 29, 2015 in Rosemont, Illinois. For information on participating in the 2015 SMTA International Conference, visit the Call for Papers page at http://smta.org/smtai/call_for_papers.cfm, or contact SMTA administrator JoAnn Stromberg at 952-920-7682 or joann@smta.org. Abstracts can be uploaded directly on-line and will be accepted through February 13, 2015.
The papers are available in the conference proceedings available in the SMTA Bookstore at http://www.smta.org/store/book_store.cfm.
For more information on SMTA International please contact SMTA administrator JoAnn Stromberg: joann@smta.org or 952-920-7682 or visit http://www.smta.org/smtai/.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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