Sep 04, 2023 
“Very thin substrates represent a special challenge for thermal processing,” said Joe Yang, product manager at BTU. “Our TrueFlat technology ensures that even substrates as thin as 0.15 mm are kept flat throughout the entire reflow process.”
Part of the industry-leading Pyramax reflow oven platform, TrueFlat technology addresses the critical challenge of substrate warpage. One of the standout features of the TrueFlat is its exceptional thermal uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15-0.30 mm, TrueFlat technology maximizes process yield.
Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.
Visit BTU International's booth at SEMICON Taiwan 2023. To learn more visit www.btu.com.
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia, and Europe. Information about BTU International is available at www.btu.com.
