Juki KE - 3020VA/ VRA

Product number: KE - 3020VA/ VRA
Detailed product introduction
Constantly improve the KE series products.
So as to realize the high speed highquality electric production line of flexible structure.
Chip components
20900 CPH chip (laser identification/bestconditions)
17100 CPH chip (laser identification/basisIPC9850)
IC components
9470 CPH (image recognition/using MNVC)
0402 (01005) inch chip ~ 01005 mm squareelement, or 50 * 150 mm
KE - 3020 VAR
Laser mount head * 1 (6 suction nozzle) +high resolution visual attachment head * 1 (1 suction nozzle)
KE – 3020VRA
The laser head 1 (6 nozzle) + FMLA IC patchhead 1 (1 nozzle) 
Using electric double-track feeder, maximumload 160 kinds of components.
MNVC are installed in the standard
High speed continuous image recognition
Tray high-speed supply components (option)
Long size base plate (option)
Corresponding to the PoP live-fire (option)
Parameters:
Substrate size
M type base board (330 mm * 250 mm)
L base board (410 mm * 360 mm)
L - Wide substrate (510 x 360 mm) * 1
XL type base board (610 mm * 560 mm)
Long size substrate (L) substratespecification * 2:8 00 x 360 mm
Long size substrate (L - Wide substratespecifications) * 2:1, 010 x 360 mm
Long base board size (XL type substratespecifications) * 2:1, 210 x 560 mm
Element height: 12 mm specifications / 20mm specifications / 25 mm (XL type substrate specifications)
Element size
Laser identification: 0402 (01005) inchchip ~ 33.5 mm square element
Image recognition
Standard camera: 3 mm ~ 74 mm squareelement, or 50 * 150 mm
High resolution camera (are) of choose andbuy: 1.0 mm x 0.5 mm * 3 square element, or 24 ~ 48 mm x 72 mm
Components in speed
Chip components
Best conditions: 20900 CPH
IPC9850:17100 CPH
IC components, * for these 470 CPH * 5
Component placement accuracy
Laser identification: + / - 0.05 mm (Cpk ≧ 1)
Image recognition: + / - 0.03 mm (MNVC + /- 0.04 mm)
Element SMT categories: up to 160 species(converted to 8 mm band (using a dual-track type belt type feeder)) * 6
Remark:
* 1 L - Wide substrate specifications forthe choose and buy goods
* 2 long size base slabs should bespecifications for the choose and buy goods
* 3 when using high resolution camera(options).
* 4 actual efficiency: IC components inspeed is in M size substrate finishing pasted on 36 QFP (more than 100 needles)or BGA conversion value (more than 256 goals).
Average 1 hour of SMT components (CPH =number)
* 5 use MNVC, the suction nozzle to learnat the same time the conversion value. KE - 3020 - v/KE - 3020 vr MNVC areinstalled in the standard.
* 6 use EF08HD